OMNIVISION has launched a 5MP global shutter HDR sensor platform. The 2.2 µm OG05D reaches 146 fps in linear mode while combining backside illumination, near-infrared sensitivity and single-exposure HDR.
Silicon Box has passed one billion advanced packaging shipments worldwide. The Singapore manufacturer now targets two billion units before year-end as capacity continues expanding.
AlixLabs has entered NanoIC evaluation for atomic pitch splitting technology. The six-month programme tests APS inside an advanced semiconductor integration environment.
Space Forge has gained DARPA ERIS awardable status for semiconductors. The assessment opens a US government route for its microgravity materials manufacturing technology.
Aratas has begun independent operations following its separation from OMRON. The component manufacturer now controls development, production, and growth strategy under Carlyle-backed ownership.
STMicroelectronics has launched compact 75V motor drivers for industrial systems. The STSPIN9P family integrates power MOSFETs, sensing, protection, and flexible motor control.
XIVER has secured financing for a major Dutch capacity expansion. The €55 million programme includes an ASML DUV lithography system and manufacturing upgrades.
ficonTEC and HTSI will localise advanced CPO testing in Taiwan. The partnership combines INS-2 equipment with local manufacturing, integration, qualification, and support.
Seismos opens a full-scale acoustic sensing research centre in Texas. The 2,349-foot flow loop recreates pipeline and wellbore conditions for measurement, automation, and AI development.