Texas Instruments launched a high-current smart switch for 12V systems. Integrated protection and diagnostics support motors, heaters, lamps, and capacitive loads.
TE Connectivity has expanded access to 1,500V bidirectional DC contactors. The devices target storage, charging, marine, data-centre, and industrial power systems.
HANZA is consolidating selected Finnish electronics production at Oulainen facility. Remaining Nivala and Sievi operations will pass to local management through a buyout.
Rohde & Schwarz combines fast capture with mixed-domain EMC debugging. The MXO 3 links waveform acquisition, spectrum analysis, and high-resolution measurements for earlier fault isolation.
Infineon and LS Electric will develop high-efficiency DC power systems. Their programme covers energy storage, solid-state transformers, fast protection, and AI data-centre infrastructure.
Germany will provide €659m for four new semiconductor manufacturing projects. The plants cover silicon carbide wafers, power MOSFETs, production metrology, and radiation detectors.
Intel will invest €5bn to expand processor manufacturing at Leixlip. The programme adds Intel 3 capacity, equipment, automation, and cleanroom utilisation for Xeon 6 and later products.
Vishay has narrowed automotive optocoupling for dense high-voltage control boards. The device combines 1MBd signalling, reinforced isolation, and high transient immunity in a 3.6mm SOP-5 package.
IMI has integrated compact mass-flow control for demanding OEM systems. The controllers combine sensing, valve actuation, electronics, and digital communications for semiconductor, analytical, medical, and industrial equipment.