Vishay has launched 30A common-mode chokes for high-current filtering applications. Commercial and automotive versions target converters, inverters, chargers, motor controls, and EMI suppression.
Beijing has launched an atomic-scale manufacturing programme for advanced semiconductors. The 2026–28 plan covers etch, deposition, implantation, process software, precision equipment, metrology, pilot facilities, and industrial demonstration.
Beijing has launched a three-year AI4Chip semiconductor industry development programme. The plan applies artificial intelligence across IC design, wafer fabrication, packaging, test, equipment, materials, and supporting engineering infrastructure.
SK hynix has broken ground on its Indiana HBM facility. The $4 billion project combines advanced packaging, testing, and an R&D testbed, with cleanroom opening targeted for 2028 and mass production in 2029.
Lam Research has started building its new Oregon semiconductor laboratory. The 120,000ft² project expands cleanroom capacity, deposition and etch development, materials work, and hardware validation.
Nordson has expanded Vantage dispensing for panel-level semiconductor packaging applications. Vantage XL combines thermal control, alignment, confocal height sensing, and inspection for larger-format advanced packaging processes.
Trymax has secured equipment orders supporting AOI’s InP laser production. The systems will handle plasma ashing and UV curing as AOI expands high-speed optical transceiver capacity in Texas.