Vertiv combines virtual AI factory design with prefabricated infrastructure deployment. Its NVIDIA DSX-based approach models faster engineering and commissioning, while Polar Data Centers is applying factory-built power and cooling systems to a 41 MW development in Norway.
ASMPT has developed placement hardware for heavy AI processor packages. Its SOLO head handles BGAs measuring up to 240 × 240 mm and initially weighing more than 2 kg, with an increase towards 5 kg planned.
Navitas expands 2,300 V SiC modules with new connection options. The 21 October announcement adds higher-current press-fit variants and pre-applied thermal interface material to an 8 mΩ module already listed for sampling in April.
Four Japanese companies will develop manufacturing processes for optical chiplets. The NEDO-backed programme combines photonic device production, silicon photonics and advanced packaging, targeting a pilot line and substantially greater manufacturing productivity.
Axcelis has begun expanding semiconductor equipment manufacturing capacity in Korea. Its 20 October Pyeongtaek groundbreaking advances an existing $35 million investment plan, with manufacturing at the enlarged facility scheduled for the second half of 2028.
Algorized and ZHAW are researching predictive sensing for collaborative robots. Their two-year project combines wireless and optical measurements to estimate human movement and provide robot controllers with information about the confidence of those predictions.