Category: Industrial
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Rehm combines convection, condensation and vacuum in complex PCB soldering. Its Vision RCC system integrates convection, vapour-phase soldering and vacuum processing, with a stated maximum assembly mass of 25 kg.
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Kontron and NOFFZ automate production testing of German 5G modules. Parallel RF and functional checks, robotic handling and laser marking support traceability at the German production site.
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ifm has introduced its LDH313 sensor for dew-point monitoring applications. The instrument measures compressed-air pressure dew point from −20°C to +20°C, supports pressures up to 50 bar and provides IO-Link and 4–20mA analogue output.
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ASMPT recorded unprecedented orders for semiconductor and electronics manufacturing equipment. Third-quarter bookings reached HK$8.85bn, up 137.9% year on year, with demand for thermocompression bonding, photonics and surface-mount assembly systems.
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SECO has launched software for coordinating industrial edge AI deployments. Clea 2.0 combines model distribution, fleet orchestration and permission-controlled operations across supported hardware, with early access offered free of charge until 30 April 2027.
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ASRock Industrial has listed publicly while expanding embedded computing operations. The company identifies edge AI, industrial cybersecurity and open architectures as priorities for its next phase.
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Fluke has developed inspection tips for densely populated optical connections. The additions extend access for the existing FI-3000 FiberInspector Pro without disturbing adjacent active fibre cables.
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Avnet Silica has expanded Teltonika distribution across the EMEA region. The new master agreement extends a five-year partnership beyond selected European markets and covers industrial routers, gateways, modems, switches, and remote management.
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Digital twins require dependable connectivity to deliver meaningful operational insights. Paul Bullock, Group Chief Product Officer at Wireless Logic, explains how resilient IoT networks support factory-scale digital twins, predictive maintenance, and timely decisions.
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Seika details stencil measurement research at Rochester Institute of Technology. Its operating Sawa T100 inspection system supports comparative testing of stencil geometry and repeatability for ultra-high-density electronics assembly.