Category: Industrial
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Vishay has introduced a 45mm inductive encoder for industrial positioning. The RAIK045I MP combines 16-bit resolution, at least 14-bit repeatability, 10-bit absolute accuracy, and operation to 10,000rpm while remaining resistant to external magnetic fields.
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Antaira is expanding industrial networking around higher-power PoE infrastructure products. New and current switches combine IEEE 802.3bt delivery, Layer 3 routing, fibre uplinks, outdoor wireless links, and central management for surveillance and industrial edge installations.
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GlobalFoundries and MPS will move power processes into Singapore production. The long-term agreement transfers proprietary MPS technology to a 300mm fab, with volume output for automotive, industrial automation, robotics, AI, and cloud applications targeted from early 2027.
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Pickering reports substantially lower thermal EMF from Series 120 relays. Controlled testing recorded a 46.4µV final offset magnitude against 402.6µV for a comparable 4mm-class device after 600 seconds of coil energisation.
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SolarEdge and Infineon are developing semiconductor protection for 800VDC distribution. Their solid-state circuit-breaker architecture uses silicon carbide JFET technology to target microsecond fault isolation between high-voltage conversion equipment and increasingly power-dense AI compute racks.
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Elmos secures 130nm wafer capacity from SK keyfoundry through 2037. The agreement extends an 18-year foundry relationship and supports a new automotive platform beginning with the E550.01 four-channel eFuse controller and a planned compact eFlash memory cell.
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Arm has expanded Total Design into physical AI development ecosystems. Its six-level robotics framework aims to give autonomous systems a common capability language.
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SYSGO has added PikeOS support to Kontron’s rugged VX3060 platform. The validated BSP targets mixed-criticality systems across defence, transport, and industrial automation.
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Comcores has appointed AVANT to expand Asian Ethernet IP support. The partnership adds local application engineering for TSN, switching, and security IP across China and Taiwan.
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NEURA and SECO will build robot compute modules in Europe. The Qualcomm Dragonwing-based hardware will support distributed processing and planned series manufacture for cognitive robotics.