Avalon and Zollner are forming an Indian electronics manufacturing venture. The operation will combine PCBA, box-build, integration, testing, sourcing, and lifecycle services for industrial and high-reliability equipment.
Peer Software is accelerating Würth Elektronik’s global CAD collaboration workflows. PeerGFS synchronises engineering data across three continents, providing local file access while controlling conflicting edits and supporting recovery after infrastructure failures.
Sivers will invest $30 million expanding Glasgow photonics manufacturing capacity. The programme targets annual production above 100 million CW DFB lasers as optical-interconnect customers move towards higher volumes.
Electroninks has formed an advanced packaging partnership with two suppliers. EMD Electronics will establish an application laboratory at Qualipoly to accelerate conductive-material qualification and process development.
Syrma SGS Elemaster has opened a new Bengaluru electronics plant. The 20,000 sq ft facility combines SMT, through-hole, and box-build assembly for high-reliability industrial, medical, transport, and energy applications.
Innolux has unveiled Chip-Last FOPLP for advanced semiconductor packaging production. Its HIPoS platform uses 620 × 670mm panels and targets 2/2µm redistribution-layer geometry ahead of planned 2027 mass production.
TT Electronics has raised expectations after first-half profitability improved sharply. Cleveland is profitable again, Components has returned to profit, and the group expects 2026 adjusted operating profit to beat current market expectations.