Category: Industrial
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Syrma SGS Elemaster has opened a new Bengaluru electronics plant. The 20,000 sq ft facility combines SMT, through-hole, and box-build assembly for high-reliability industrial, medical, transport, and energy applications.
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Innolux has unveiled Chip-Last FOPLP for advanced semiconductor packaging production. Its HIPoS platform uses 620 × 670mm panels and targets 2/2µm redistribution-layer geometry ahead of planned 2027 mass production.
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TT Electronics has raised expectations after first-half profitability improved sharply. Cleveland is profitable again, Components has returned to profit, and the group expects 2026 adjusted operating profit to beat current market expectations.
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Vishay has launched 30A common-mode chokes for high-current filtering applications. Commercial and automotive versions target converters, inverters, chargers, motor controls, and EMI suppression.
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Qualcomm has launched IQ-2390 for compact industrial edge computing platforms. The processor combines AI, vision, TSN networking, real-time control, and long-lifecycle support.
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Beijing has launched an atomic-scale manufacturing programme for advanced semiconductors. The 2026–28 plan covers etch, deposition, implantation, process software, precision equipment, metrology, pilot facilities, and industrial demonstration.
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Beijing has launched a three-year AI4Chip semiconductor industry development programme. The plan applies artificial intelligence across IC design, wafer fabrication, packaging, test, equipment, materials, and supporting engineering infrastructure.
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Renesas has opened a Beijing laboratory for physical AI robotics. The facility combines processing, sensing, power, software, control, and system verification as the semiconductor supplier expands its role in complete robot development.
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SK hynix has broken ground on its Indiana HBM facility. The $4 billion project combines advanced packaging, testing, and an R&D testbed, with cleanroom opening targeted for 2028 and mass production in 2029.
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Lam Research has started building its new Oregon semiconductor laboratory. The 120,000ft² project expands cleanroom capacity, deposition and etch development, materials work, and hardware validation.