Imec has advanced its 300mm RF silicon interposer platform further. The work adds embedded capacitors, passive modelling, and laser-assisted bonding for III-V chiplets on Si-CMOS.
Qorvo has introduced its compact X-band radar front-end module package. The QPF5012 combines power, efficiency, and receive sensitivity for arrays.
Celera has acquired SiliconGate to expand analogue IC design capability. The deal adds Portuguese power-management expertise, silicon-proven IP, and design capacity for custom semiconductor development.
Cambridge GaN Devices is sampling automotive ICeGaN for inverter designs.
onsemi has launched a SiC pairing tool for power designers.
ROHM is bringing GaN epitaxy in-house with AIXTRON production equipment.
Mouser is shipping TDK’s AMT45S pulse transformer for EV charging. The compact component targets power line communication circuits used in CCS and NACS charging systems, supporting isolation, signal integrity, and charging control.
Atomera is targeting RF GaN-on-silicon performance with MST processing. The approach uses an oxygen-modified silicon layer to reduce parasitic channel charge, aiming to narrow the performance gap between lower-cost silicon substrates and established RF GaN-on-SiC platforms.
Toshiba has introduced automotive MOSFETs for compact power switching designs. The 40V N-channel devices use SOP Advance(EWF) packaging to improve current capability, reduce on-resistance, and support vehicle systems including load switches, relays, inverters, and motor drives.