Category: Products
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Q2 2026 made electronics design constraints much harder to ignore. Memory, packaging, optics, EDA automation, edge AI, and power delivery all carried forward existing pressures, while adding sharper evidence of how advanced systems are now limited by more than processors alone.
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FORTEC UK has expanded the compact Delta medical power range. The MEP-500A family now includes open-frame, enclosed, and top-fan cooled 500W models.
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Dynex Semiconductor has developed a high-current 650V GaN power module. The 450A half-bridge design uses PCB embedding and double-sided cooling for dense industrial power conversion.
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Oriole Networks is deploying photonic AI networking with AMD hardware. The UK startup’s PRISM platform will be tested inside ARIA’s Scaling Inference Lab for latency, throughput, and accelerator utilisation.
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Berlin researchers have reached certified CIGS-perovskite tandem cell efficiency records. The 25.5% result strengthens thin-film photovoltaic development where interfaces, stability, and manufacturable scale remain decisive.
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PureFize has demonstrated Far-UVC emission from a tunable platform today. The Swedish developer’s field-emission and cathodoluminescence approach targets compact disinfection systems below 240nm.
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Allegro DVT is backing the European CHASSIS automotive chiplet programme. Its video IP will help the 5nm base die handle camera, cockpit, and software-defined vehicle workloads.
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Infineon has completed its ams OSRAM sensor portfolio acquisition today. The deal adds analogue and mixed-signal sensors for industrial, automotive, and medical electronics.
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Infineon has opened its €5bn Smart Power Fab in Dresden. The site doubles local power semiconductor and analogue/mixed-signal capacity for AI infrastructure, grids, renewables, vehicles, and industrial systems.
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Vertiv has opened a Malaysian facility for AI infrastructure manufacturing. The Johor site supports power, cooling, testing, and modular deployment.