Category: Products
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Samsung has presented vertical memory concepts for future AI systems. zHBM places memory above accelerators, while zNAND-O targets dense, low-latency edge storage.
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Power Integrations has demonstrated gallium nitride technology rated at 2200V. The platform extends PowiGaN towards higher-voltage data centre, vehicle, renewable-energy, and HVDC conversion.
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Wolfspeed silicon carbide is qualified for LITEON’s 800VDC power platforms. The partnership links SiC device supply with rack and sidecar systems for hyperscale AI data centres.
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Molex has combined power and Ethernet within one miniature connector. MiniMix targets compact robotic joints where separate interfaces complicate routing and assembly.
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AI data centre demand lifted Infineon to record quarterly revenue. Power & Sensor Systems led the increase as server and data centre orders strengthened.
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Infineon’s 512Mb NOR Flash has qualified for MediaTek’s C-X1 platform. The approval gives automotive developers a validated boot memory option for software-defined cockpit systems.
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AMD’s embedded revenue climbed nineteen per cent during the quarter. New processors, adaptive systems-on-chip, and modules broaden its industrial and edge-computing portfolio.
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onsemi projects AI data-centre revenue will more than double annually. Its portfolio spans silicon, silicon carbide, gallium nitride, and controllers across the rack power chain.
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Ambiq has released open-source profiling software for Apollo edge-AI hardware. The alpha tool measures execution cycles, memory use, and optional real-time power.
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NXP will supply BMW with integrated UWB ranging and radar. The single-chip platform supports digital keys, occupant detection, and additional vehicle functions.