Category: Products
-
Data-centre power design is shifting rapidly toward higher-voltage distribution architectures. Rack-level storage and solid-state protection are becoming central to AI infrastructure engineering.
-
STMicroelectronics is advancing edge imaging beyond conventional camera component boundaries. Its FlightSense and BrightSense platforms combine depth sensing, vision, local processing, and low-power operation.
-
MEMPHIS Electronic will address memory uncertainty at FMS 2026 soon. Its focus is availability, migration, and lifecycle planning for embedded designs.
-
Panasonic has brought its PhotoMOS selector app to Android devices. The tool helps narrow more than 400 photo-coupled MOSFET relay options.
-
ROHM has detailed fifth-generation SiC MOSFETs for power conversion systems. The devices target lower losses and higher density in automotive, server, and industrial applications.
-
SiTime has completed its acquisition of Renesas’ timing business unit. The deal expands precision clocking capacity for AI, communications, automotive, and industrial electronics.
-
Lauterbach has added TRACE32 support for NXP CoolFlux DSPs development. The update extends debug and non-intrusive trace coverage for low-power signal-processing systems.
-
Rutronik is offering Intel processors for physical AI systems deployments. The devices combine CPU, GPU, and NPU resources for robotics and automation.
-
MediaTek and Samsung have advanced five-layer 5G uplink performance testing. The demonstration reached 670Mbps using MediaTek’s M90 modem and Samsung’s vRAN and radio systems.
-
Sony Semiconductor has joined MIPI’s board as a Promoter member. The move strengthens image-sensor input into interface standards used across embedded vision, automotive, IoT, and mobile-influenced systems.