CGD and NXP are collaborating on GaN power-conversion system designs. The work targets data-centre, automotive, and industrial designs needing higher efficiency and density.
CSA Catapult will become the UK’s Semiconductor Catapult this summer. The transition broadens support for chip R&D, validation, commercialisation, and AI hardware deployment.
QPT has launched qDesign for AI-optimised power module packaging workflows.
Cambridge GaN Devices is sampling automotive ICeGaN for inverter designs.
ODU has supplied mass interconnects for automated DEIF converter testing.
Cyntec is showing battery junction box components for EV architectures.
onsemi has launched a SiC pairing tool for power designers.
Fraunhofer IAF is demonstrating GaN power modules for bidirectional charging.
Infineon will supply SiC modules for Siemens semiconductor circuit breakers.
ROHM is bringing GaN epitaxy in-house with AIXTRON production equipment.