Home | IN Electronics & Design

Skip to content

News
Features
Design
Electronics
Markets
Products
Magazines
About

Search

Subscribe for unlimited access to the latest electronics and design engineering insight

Lattice brings AI assistance into FPGA design

Lattice brings AI assistance into FPGA design

MACOM launches 3.2T optical front-end chipset

MACOM launches 3.2T optical front-end chipset

GlobalFoundries expands SiGe capacity for Marvell optics

GlobalFoundries expands SiGe capacity for Marvell optics

Tower and NewPhotonics ship laser-integrated optical engines

Tower and NewPhotonics ship laser-integrated optical engines

Aetina links Jetson Thor AI with EtherCAT control

September 18, 2026
Report details Europe’s AI electronics manufacturing gap

September 18, 2026
Infineon adds dual gate driver for AI power

September 18, 2026
Prodrive ships 105MP Runix machine vision camera

September 18, 2026
Elmos extends Dortmund wafer capacity through 2028

September 18, 2026
Besi joins Tata advanced packaging build-out

September 18, 2026
Nexperia and Tata link front-end and packaging

September 18, 2026
MemryX and Lenovo expand Saudi edge AI

September 17, 2026

Latest industry news

LG Chem builds Chinese semiconductor IPA supply route

15/9/2026

LG Chem will supply semiconductor-grade IPA feedstock into China directly.…
Anglia adds Adam Tech to European distribution portfolio

15/9/2026

Anglia has added Adam Tech through a pan-European franchise agreement.…
Teltonika embeds industrial connectivity with Oxa gateway

15/9/2026

Teltonika has launched Oxa for embedded industrial cellular connectivity applications.…
ZEISS launches hybrid VersaXRM 5 Insight platform

15/9/2026

ZEISS has launched VersaXRM 5 Insight for multiscale X-ray analysis.…
ASML examines EUV output above 110 systems

15/9/2026

ASML is examining output above 110 EUV systems in 2028.…
ST launches VD56GA for in-cabin infrared sensing

15/9/2026

ST has launched VD56GA for lower-cost automotive infrared cabin sensing.…

1 … 5 6 7 8 9 10

Featured

The race to move AI data at the speed of light
GDPR and the transformation of IoT security
AI brings real-time intelligence to medical electronics
High-power delivery for industrial AI-ready networks
Dismantled: Q2 2026

Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Jul 23

2026

GDPR and the transformation of IoT security
Jul 17

2026

AI brings real-time intelligence to medical electronics
Jul 14

2026

High-power delivery for industrial AI-ready networks
Jul 4

2026

Dismantled: Q2 2026
Jun 25

2026

Resilience as the cornerstone of medical device manufacturing
Jun 19

2026

IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic

Electronics

—

MACOM launches 3.2T optical front-end chipset

MACOM has launched a 3.2T optical front-end chipset platform today.…

GlobalFoundries expands SiGe capacity for Marvell optics
Tower and NewPhotonics ship laser-integrated optical engines
Report details Europe’s AI electronics manufacturing gap
Infineon adds dual gate driver for AI power
Micas expands Malaysian production for commercial CPO

Design engineering

—

Lattice brings AI assistance into FPGA design

Lattice has introduced an AI assistant for FPGA design flows.…

Keysight joins Verizon forum for 6G validation
Arteris extends NoC across multi-die chiplets
Cadence and ADI build next SHARC core
BAE requalifies RH45 rad-hard ASIC platform
Murata and Smart Eye fuse cabin sensors

Part of the
Industrial News Network

© 2b Publishing 2026.

About
Industrial News

Notifications