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Rapidus signs UK semiconductor centre agreement

Rapidus signs UK semiconductor centre agreement

Synopsys releases Multiphysics Fusion tools

Synopsys releases Multiphysics Fusion tools

Taiwan Semiconductor adds TQM MOSFETs

Taiwan Semiconductor adds TQM MOSFETs

Toshiba adds MOSFETs for 48V systems

Toshiba adds MOSFETs for 48V systems

Kontron launches rugged TSN defence switch

June 19, 2026
Xiphera joins Finnish secure SoC programme

June 19, 2026
HMS launches rugged industrial Ethernet switches

June 19, 2026
IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic

June 19, 2026
Robin Radar extends drone sensing to sea

June 19, 2026
u-blox adds European wireless modules

June 19, 2026
Agile Analog and Xiphera combine chip security

June 18, 2026
TE sensors reach Mouser for isolation designs

June 18, 2026

Latest industry news

ESCATEC secures UK medical manufacturing certification

12/6/2026

ESCATEC has secured ISO 13485 certification at its UK facility.…
Qorvo adds compact X-band radar front end

12/6/2026

Qorvo has introduced its compact X-band radar front-end module package.…
Altera samples Agilex 9 Direct RF FPGA

12/6/2026

Altera is now sampling Agilex 9 Direct RF-Series SoC FPGAs.…
MAHLE and Rohde & Schwarz advance ADAS testing

12/6/2026

MAHLE and Rohde & Schwarz have combined calibration with radar.…
Siemens and Samsung strengthen silicon design flows

12/6/2026

Siemens and Samsung Foundry are extending advanced-node EDA collaboration flows.…
RISC-V summit advances European open hardware

12/6/2026

RISC-V Summit Europe has opened in Bologna around deployable hardware.…

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Featured

IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic
The manufacturing challenge facing scaling UAV developers
Building traceability and control in battery manufacturing
The trials and tests of the best available adhesive
Dismantled: March 2026

Latest issue

Features

How ASIC applications impact material considerations

Material choices are critical in the design and performance of ASICs. Ross Turnbull, Director of Business Development and Product Engineering at Swindon Silicon Systems, explains how material considerations vary across applications, and the importance of getting it right.

Jun 18

2026

The manufacturing challenge facing scaling UAV developers
Jun 16

2026

Building traceability and control in battery manufacturing
Jun 15

2026

The trials and tests of the best available adhesive
Apr 8

2026

Dismantled: March 2026
Mar 4

2026

Dismantled: February’s electronics bottlenecks moved further downstream
Feb 20

2026

AI inference pushes NAND supply into constraint

Electronics

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Rapidus signs UK semiconductor centre agreement

Rapidus has signed a UK agreement on semiconductor manufacturing collaboration.…

Synopsys releases Multiphysics Fusion tools
AMD and Rackspace scale enterprise AI
The manufacturing challenge facing scaling UAV developers
Microchip adds Class Y in Nantes
Memory surge pushes chip market past $319bn

Design engineering

—

Rapidus signs UK semiconductor centre agreement

Rapidus has signed a UK agreement on semiconductor manufacturing collaboration.…

Synopsys releases Multiphysics Fusion tools
Xiphera joins Finnish secure SoC programme
IN Conversation: inserting next-gen connectivity into legacy platforms with Filtronic
Agile Analog and Xiphera combine chip security
Keysight adds wideband RF signal analysers

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