Category: News
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Microelectronics UK will bring five technical stages back to London. The programme covers semiconductors, photonics, embedded systems, edge AI, and engineering skills.
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Astute has added UTA modules as memory shortages spread upstream. The agreement gives embedded developers additional cellular and positioning options during constrained supply.
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Cadence and Synopsys have certified advanced Intel foundry design flows. The support spans implementation, sign-off, IP, multiphysics analysis, and heterogeneous packaging.
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Astemo is preparing two Bolton inverter lines for automotive production. The £100 million programme includes power-electronics PCB assembly and final inverter manufacturing.
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Memory-safe languages correlate with lower embedded development and maintenance costs. A VDC study compares language decisions across safety-critical and real-time engineering programmes.
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Samsung and Broadcom are aligning memory, foundry, and packaging roadmaps. Their expanded agreement joins HBM supply with advanced-node manufacturing and heterogeneous integration.
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AMD has combined heterogeneous processing within a production-ready robotics platform. CPU, GPU, NPU, and programmable-logic resources support perception, planning, inference, control, and industrial connectivity.
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Siemens is adding deterministic verification to long-running agentic EDA workflows. The system connects generative automation with established simulation, implementation, test, and sign-off engines for semiconductor and PCB development.
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LITILIT is expanding femtosecond-laser production for PFAS-free surface processing applications. Micro- and nanoscale texturing can replace selected fluorinated coatings and chemical treatments.
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DigiKey and Machinechat have combined sensors, hardware, and local software. The rapid engineering kit turns environmental measurements into dashboards, storage, and alerts.