Category: News
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Advanced Energy has compressed 1.1kW PFC into half brick dimensions. The module combines 97.3% peak efficiency, PMBus control, and universal mains input.
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Toshiba has introduced compact photorelays for dense semiconductor test systems. The devices combine 2A switching, low leakage, and substantially reduced PCB area.
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NVIDIA has expanded its toolkit for AI assisted semiconductor engineering. Physics informed models, accelerated solvers, and deeper EDA integrations extend the platform across chip, package, and PCB development.
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Toray’s polymer film could substantially reduce lithium ion collector weight. The copper coated substrate is now being sampled from production equipment.
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Infineon’s configurable automotive eFuse brings software control to wire protection. SPOC Wire Guard supports zonal architectures, diagnostics, and fail operational systems.
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Weald has expanded UK access to rugged connectors through Rayfast. The agreement covers interconnect products for defence, medical, energy, and industry.
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TI brings modern 32 bit control into established industrial 5V systems. MSPM0H321x devices combine analogue integration, wide temperature operation, and familiar interfaces.
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Digi combines mesh, cellular, edge computing, and cloud gateway functions. XBee Hive kits provide a pre integrated platform for remote industrial systems.
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European building rules are accelerating connected lighting controls across properties. Larger non residential buildings face staged requirements for occupancy based automation.
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MIKROE combines local and remote temperature monitoring on one board. The TMP411 based module provides programmable alarms and junction fault detection.