Category: News
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ams OSRAM has secured strategic leadership continuity through September 2031. Aldo Kamper will oversee its concentration on optical semiconductors, digital photonics, automotive lighting, and microLED technology.
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CEA-Leti is moving three dimensional integration into future AI architectures. Fine pitch hybrid bonding is being developed alongside new approaches to power, memory, cooling, and test.
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Global silicon wafer shipments rose sharply during 2026’s second quarter. AI demand broadened beyond processors and memory as industrial and automotive semiconductor markets recovered.
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Renesas has raised DDR5 MRDIMM bandwidth to 16,000MT/s for servers. The third generation chipset targets AI and high performance computing platforms while retaining established DDR5 infrastructure.
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Innodisk has introduced 12,800MT/s DDR5 MRDIMMs for modern AI servers. Multiplexed rank access increases bandwidth without replacing the established DIMM form factor.
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Delta’s automotive charging process has reached ASPICE Capability Level 2. The assessment covers managed development across engineering, testing, and final validation.
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Infineon flash has qualified for ASPEED’s latest server management controller. Approved vendor status gives AST2700 designers validated BMC firmware storage.
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Element14 has opened a healthcare and smart home design challenge. Selected participants will receive component kits and document complete working prototypes.
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Altus is expanding its Redditch headquarters around connected production lines. The centre will integrate SMT, through hole, backend, and component management equipment.
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BAE Systems and Lockheed Martin are advancing a modular jammer. Blizzard is being developed for electronic attack, decoy, and suppression missions.