Category: News
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UKBIC has appointed Jason Watkins as its new commercial director. He joins the Coventry battery manufacturing development facility to lead business development, sales, and customer project delivery as UK battery scale-up demand intensifies.
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ECSA has opened 2026 applications for its microelectronics summer school. The Bologna programme runs in late August, covering semiconductor technology, IC design, embedded intelligence, and integration, with a focus on building the engineering pipeline Europe’s chip projects will need.
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Mastercam 2026.R2 shifts simulation workloads from CPU to GPU hardware. A new GPU-accelerated verifier and the Copilot assistant target faster toolpath checks and fewer repetitive edits, as the company moves to a twice-yearly major release cadence.
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Omron’s S8AS2 targets crowded control cabinets with smarter DC distribution. It combines a 24 V power supply, branch-level electronic protection, and live diagnostics, aiming to simplify wiring and isolate faults without taking an entire panel offline.
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ifm’s O2I2 readers pack high-speed code capture into tight footprints. The compact multicode units read up to 50 codes per second, apply deep learning for damaged marks, and connect via Ethernet or RS232 for tracking, AGVs, and semiconductor traceability.
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Blueshift will bring low-outgassing thermal tapes to JEC World Paris. The company is positioning AeroZero tapes and flame barriers for lightweight spacecraft and aerospace electronics protection.
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Renesas will license EPC’s eGaN for low-voltage power devices globally. The deal adds second-sourcing and aims to accelerate GaN adoption in AI power, robotics, and compact converters.
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Samsung will co-develop chip processes at Applied’s new EPIC Center. The $5bn facility targets atomic-scale patterning, etch, deposition, and extreme 3D integration across logic and memory.
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Kontron brings Panther Lake and Ryzen AI to Embedded World. New industrial SBC and mITX platforms add integrated NPU acceleration, plus cybersecurity features aligned with EU Cyber Resilience Act requirements.
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BorgWarner’s BMS contract expands to more EV platforms from 2029. A modular BMU–CMU architecture targets 800V packs, DC fast-charge communication, and ASIL D-oriented diagnostics.