Category: News
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Vertical Aerospace has chosen Evolito to power its Valo aircraft. The partnership centres on integrated electric propulsion units combining ultra-lightweight motors and DAL-A power electronics, with the two companies aiming to certify the engines with the UK CAA, alongside EASA validation.
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Edinburgh team reports a recoverable hexagonal germanium–tin semiconductor class today. The group used extreme pressure and heat to create stable GeSn alloys that could improve light–electricity conversion in optoelectronic components for processors, imaging systems, and data-centre hardware.
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TDK-Lambda has introduced a 1U 3.5kW hot-swap supply for industry. The HFE3500 series supports redundant rack configurations and parallel operation, targeting automation, ATE, and communications systems that need high-density bulk power with monitoring and control via PMBus.
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Variscite has launched its first SMARC module family today, globally. The VAR-SMARC-MX8M-PLUS targets compact industrial and medical edge designs, combining NXP’s i.MX 8M Plus with dual Gigabit Ethernet (IEEE1588 support), expanded USB, and an on-module TPM 2.0 security device.
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Raspberry Pi is raising prices again across higher-memory boards globally. The company cites sharply higher LPDDR4 costs, with increases applied to Raspberry Pi 4 and 5, plus Compute Module 4 and 5 products at 2GB and above, while 1GB variants and LPDDR2-based products are unaffected.
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Component obsolescence remains a persistent risk for electronics manufacturers globally. ByteSnap Design has launched a free interactive BOM Health Self-Assessment tool to help engineering leaders quantify their exposure and evaluate whether existing BOM management processes are sufficient before disruption occurs.
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TactoTek has licensed IMSE manufacturing rights to GTV in Michigan. The deal positions a local partner to prototype and tool injection-moulded smart surfaces with integrated touch, lighting, and circuit structures for automotive and other sectors.
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UCLA scientists cut flicker noise in nanowires for sensors dramatically. The team demonstrated an ultra-low-noise transport regime in quasi-1D materials, indicating a path toward higher-fidelity medical sensing and more stable quantum devices.
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Cree LED is targeting brighter displays using less power now. Its OptiLamp components integrate driver and control intelligence inside each LED pixel, aiming to cut system complexity while improving image quality and long-term maintainability in large-format display deployments.
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Keysight and Point2 are testing RF interconnects for AI clusters. The companies are using Keysight BERT and sampling scopes to characterise Point2’s e-Tube plastic-waveguide links at multi-terabit data rates.