Category: News
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PureFize has demonstrated Far-UVC emission from a tunable platform today. The Swedish developer’s field-emission and cathodoluminescence approach targets compact disinfection systems below 240nm.
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Allegro DVT is backing the European CHASSIS automotive chiplet programme. Its video IP will help the 5nm base die handle camera, cockpit, and software-defined vehicle workloads.
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Infineon has completed its ams OSRAM sensor portfolio acquisition today. The deal adds analogue and mixed-signal sensors for industrial, automotive, and medical electronics.
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Infineon has opened its €5bn Smart Power Fab in Dresden. The site doubles local power semiconductor and analogue/mixed-signal capacity for AI infrastructure, grids, renewables, vehicles, and industrial systems.
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Vertiv has opened a Malaysian facility for AI infrastructure manufacturing. The Johor site supports power, cooling, testing, and modular deployment.
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Nightfood has signed a semiconductor automation acquisition letter of intent. The proposed deal covers Taiwan-based Jiun Jiang Enterprise and TechForce Robotics.
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FTG has opened its first Indian aerospace electronics manufacturing facility. The Hyderabad site adds cockpit, avionics, and high-reliability electronics capacity.
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MKS is expanding Atotech manufacturing capacity for AI infrastructure demand. The Guangzhou investment targets semiconductor, advanced packaging, and PCB process equipment.
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Mouser has expanded its industrial automation supplier line-up this year. The additions cover sensing, connectivity, power, control, cabling, and instrumentation.
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Rutronik is supplying TDK Micronas sensors for compact motor drives. The HAL 13xy family supports position and speed detection in constrained designs.