Foxconn and Mitsubishi Electric have signed an automotive partnership agreement. A proposed ¥115bn transaction for half of Mitsubishi Electric Mobility remains subject to approvals and closing adjustments, with completion expected on 1 October 2027.
DigiKey is expanding component fulfilment capacity through new automation investments. The $100m programme covers picking, packing and order management over 18 months; its first new packing system is on site but not yet reported as operating.
SAKI introduces an inline underside PCB inspection system for assembly. The 3Di-LS3BX specifies 15µm optical resolution separately from its stated 200µm solder-ball detection, with defined board dimensions and conveyor weight limits.
Finchetto has started process development for Cardiff photonic circuits manufacturing. The ten-month programme will investigate thin-film lithium niobate fabrication; its 700-fold latency and 20-fold power comparisons are supplier claims without disclosed independent benchmarks.
Qilimanjaro completes the first close of its Series A financing. The secured €19.6m comes from IndraMind and SETT; further fundraising and manufacturing expansion remain planned rather than completed.
Inission has signed an agreement to acquire Bavaria Digital Technik. The €5.3m transaction is scheduled to complete on 2 November, subject to conditions; historical revenue and expected contribution are separately stated.