Category: News
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Infineon has introduced hardware-aware AI assistance for embedded development projects. Its ModusToolbox extension supplies coding agents with device, board and software configuration details to improve the suitability of generated firmware for supported PSOC microcontrollers.
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STMicroelectronics has introduced secure factory provisioning for Matter device credentials. Its MatterConnect service installs certificates, cryptographic keys and personalisation data into supported components before shipment, reducing the need for equipment manufacturers to operate equivalent secure provisioning infrastructure.
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Sivers has received its first production orders for LiDAR components. Deliveries of distributed-feedback lasers and optical amplifiers are scheduled to begin in the fourth quarter of 2026, supporting automotive and industrial sensing programmes moving towards production in 2027.
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General Micro Systems expands rugged computing through Thunderbolt peripheral modules. Its Expansion family adds processing, storage, networking and I/O options for compatible hosts; supplier cost claims and platform requalification exemptions are unproven.
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ExpressPCB has widened its checks across printed circuit board layouts. Version 3.4 examines spacing between all objects, improves fault navigation, and restores SnapMagic downloads, while fabrication suitability still requires engineering review.
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Malaysia is extending Arm technology access to local chip designers. Five companies are identified in the October initiative, but their respective licence terms, fabrication arrangements and commercial product milestones remain unconfirmed.
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Japanese partners have disclosed remote tunnel inspection networking trial results. A March demonstration used optical and wireless communications to transfer three-dimensional measurements and inspect 0.2mm cracks across a simulated 1,000km connection.
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Arbe has introduced imaging radar for autonomous off-road vehicle navigation. Gryphon combines 48 transmitting and 48 receiving channels with four-dimensional sensing, targeting obstacle detection and localisation where dust, darkness and difficult terrain affect optical systems.
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Goodix has combined biometric matching with isolated credential protection hardware. Its new integrated Match-on-Chip and secure-element offering is intended to protect authentication data, API keys and account tokens in connected and AI-enabled devices.
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TrendForce expects tighter supply of specialised capacitors used in servers. Its October bulletin links growing CPU and DDR5 demand to high-capacitance MLCC pressure, with shortages forecast to be most severe in the first half of 2027.