Category: News
-
IDS cameras are supporting 3D reconstruction of plasma jet behaviour. The work links industrial imaging with scientific, medical, and high-speed measurement applications.
-
Socionext is now developing an A14 compute chiplet validation platform. The device will validate CPU and xPU architectures for AI infrastructure.
-
APEM and Alps Alpine Europe are expanding industrial HMI collaboration. The work targets integrated controls for material handling, machinery, and off-highway equipment.
-
Data-centre power design is shifting rapidly toward higher-voltage distribution architectures. Rack-level storage and solid-state protection are becoming central to AI infrastructure engineering.
-
STMicroelectronics is advancing edge imaging beyond conventional camera component boundaries. Its FlightSense and BrightSense platforms combine depth sensing, vision, local processing, and low-power operation.
-
MEMPHIS Electronic will address memory uncertainty at FMS 2026 soon. Its focus is availability, migration, and lifecycle planning for embedded designs.
-
Panasonic has brought its PhotoMOS selector app to Android devices. The tool helps narrow more than 400 photo-coupled MOSFET relay options.
-
ROHM has detailed fifth-generation SiC MOSFETs for power conversion systems. The devices target lower losses and higher density in automotive, server, and industrial applications.
-
SiTime has completed its acquisition of Renesas’ timing business unit. The deal expands precision clocking capacity for AI, communications, automotive, and industrial electronics.
-
Lauterbach has added TRACE32 support for NXP CoolFlux DSPs development. The update extends debug and non-intrusive trace coverage for low-power signal-processing systems.