Category: News
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Molex has launched HSAutoLink G for faster automotive Ethernet links. The connector system supports ADAS, LiDAR, radar, displays, and zonal architectures.
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Toshiba has launched an 80V MOSFET for AI infrastructure power. The device targets switched-mode supplies in data centres, base stations, and industrial equipment.
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OMRON has introduced high-voltage SiC relays for demanding switching applications. The G3VH range targets industrial drives, renewables, storage, and semiconductor test.
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Kingboard has raised funds to expand advanced PCB production capacity. The placement supports laminate, multilayer, HDI, and R&D investment.
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Somacis has completed the Group ACB deal, expanding PCB capacity. The move adds French and Belgian manufacturing sites to a wider high-reliability electronics platform.
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Keysight and WIN have linked GaN MMIC design workflows tightly. The environment joins simulation, layout verification, and evaluation-board optimisation before tapeout.
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SiTime has launched Chorus 2 timing devices for compute systems. The programmable clocks target AI clusters, networking, smart-factory vision, and heterogeneous boards.
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Lattice has brought CrossLinkU-NX SoM hardware into wider distribution channels. The FPGA board targets embedded vision, USB connectivity, sensors, and edge-AI prototyping.
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Kyocera AVX has launched traction-grade capacitors for high-voltage converter platforms. The FFLK series targets EV traction, drives, and DC-link filtering.
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Kvaser has introduced PCIe 4xLIN for multi-channel LIN validation systems. The card supports deterministic communication, isolated channels, and hardware-in-the-loop test environments.