Keysight has joined Verizon’s forum for pre-standard 6G validation work. Its test and emulation expertise will support research into new spectrum, integrated sensing, AI-native networks, and eventual standards alignment.
Micron has demonstrated a 512GB DDR5 module for future servers. The vertically stacked RDIMM reaches up to 9,200MT/s and could give a 24-slot dual-socket system as much as 12TB of directly attached DDR5 memory.
Arteris has expanded its chiplet interconnect portfolio for multi-die designs. FlexGen Multi-Die extends non-coherent network-on-chip functions across UCIe links while preserving traffic control, quality of service, and design reuse.
Cadence Tensilica IP drives Analog Devices’ next SHARC processor architecture. The SHARC-FX core moves ADI’s automotive DSP platform to 16nm while adding higher performance, AI processing, security, memory, and connectivity capabilities.
BAE Systems will requalify its RH45 radiation-hardened ASIC design platform. The $16 million programme restores a 45nm SOI route for custom space electronics manufactured by GlobalFoundries in New York.
Murata and Smart Eye are combining radar with cabin cameras. The concept fuses 60GHz sensing with AI-based vision for occupant monitoring, child-presence detection, and future software-defined vehicle functions.
Sensirion has made its low-power SFA40 formaldehyde sensor globally available. The electrochemical device combines calibrated I²C output, 80µA typical average current consumption, and a specified operating lifetime exceeding six years.