Elephantech has shipped its first DK100 system to overseas customers. The inkjet platform metallises high-aspect-ratio microvias for dense AI-server PCB production.
L&T Semiconductor has unveiled its first 1200V silicon carbide platform. The company has also taped out an integrated BLDC controller as its device portfolio expands into power conversion and motor control.
Lattice has introduced an AI assistant for FPGA design flows. Prompt connects engineers’ chosen models and IDEs with Radiant compilation, simulation, implementation, and device documentation.
MACOM has launched a 3.2T optical front-end chipset platform today. Eight 448Gbps PAM-4 channels combine new receiver components with existing high-speed optical drivers.
GlobalFoundries and Marvell are expanding SiGe manufacturing for optical interconnects. The multi-year agreement adds Burlington capacity for pluggable, near-packaged, and co-packaged optical architectures.
Tower and NewPhotonics are shipping laser-integrated photonic engines at volume. The PH18DA devices support 800G and 1.6T links, with 6.4T near-packaged optics planned for 2027.
Europe captures little value from its growing AI infrastructure market. New research puts EU companies’ semiconductor, server, and cloud shares in single digits despite rapidly expanding demand.