Category: News
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Anglia Components has won Eaton’s UK Distribution Partner Award 2025. The recognition covers sales and support performance across Eaton’s electronics component portfolio in the UK.
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Penny Pixel partners are simplifying high-resolution embedded display system design. Powertip panels and Embedded Wizard software combine with a display-driving architecture intended to remove separate controllers and external framebuffers from lower-cost MCU designs.
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EFC has broken ground on its Texas semiconductor materials plant. The $210 million McGregor project will add chemical synthesis, specialty gas handling, laboratory and logistics capacity for US chip manufacturing.
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Raytron has launched Falcon500, a dedicated infrared AI image processor. The third-generation device combines thermal image processing, intelligent sensing, multimodal integration and precision temperature measurement for industrial and embedded imaging applications.
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Teradyne has launched Iris 100 for production microLED optical testing. The platform measures individual emitters across large arrays and combines optical characterisation with UltraFLEXplus electrical test infrastructure.
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Navitas will invest $5 million in Magnachip’s power semiconductor strategy. The equity deal deepens an existing partnership covering 1.2kV, 2.3kV, 3.3kV and higher-voltage silicon-carbide technology.
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ITRI has unveiled a 3.2Tbps silicon-photonics engine for AI networks. The design doubles its previous 1.6T generation while more than 20 partners develop supporting design, fabrication, test and packaging capability.
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Lumentum has developed an eight-wavelength laser source for AI optics. The pluggable DWDM module delivers up to 24dBm per wavelength while targeting serviceable external illumination for co-packaged and near-packaged optical systems.
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Microchip has completed its acquisition of Hailo for edge AI. The transaction adds dedicated accelerators, vision processors, robotics processors and AI software to Microchip’s wider embedded semiconductor portfolio.
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Molex has introduced VersaBeam Mini for denser AI optical links. The 16-fibre expanded-beam connector fits a 3.5 x 9mm footprint, supports up to 3,456 fibres per 1RU and enters limited sampling in Q4 2026.