Category: News
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Valens and onsemi are simplifying automotive camera connectivity designs together. Their collaboration will integrate MIPI A-PHY capability with onsemi image sensors, targeting high-volume 3MP applications where component count, interoperability, and migration from lower-resolution camera architectures matter.
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XP Power has added two medically approved DC-DC converter families. QAM60T and HBM150C target BF- and CF-rated equipment with 5kVAC isolation, low patient leakage, and quarter-brick or half-brick packaging.
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Siemens and TSMC automate DRC fixes across advanced IC workflows. The agent combines Calibre, Aprisa, and Solido software while the wider collaboration extends into advanced packaging, silicon photonics, and A14 process enablement.
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European agencies are funding AI-native methods for faster chip design. The 20-month SPRIND-NADI challenge could provide selected teams with up to €9.6 million each across architecture, RTL generation, verification, and production-ready implementation.
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Alps Alpine developed an SMD automotive encoder for automated assembly. The EC11P improves signal detection while removing manual through-hole insertion from compatible production lines.
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ITRI has unveiled a 3.2Tbps silicon photonics optical engine platform. The programme doubles its previous generation while building a commercialisation network spanning design, fabrication, packaging, and test.
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GUC has completed design of its 16Gbps HBM4E interface IP. The N2P implementation has customer adoption and a CoWoS-L tape-out, with silicon validation still ahead.
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Teradyne has launched Iris 100 for production microLED optical testing. The system characterises individual emitters while integrating optical and electrical measurements with UltraFLEXplus.
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Microamp has deployed a 5G mmWave research platform in Warsaw. The system will support communications research, NATO-related studies, laboratory training, and defence-focused experimentation.
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Sensirion has launched compact modules measuring ten indoor parameters simultaneously. SEN68 combines particulate, gas, temperature, and humidity sensing, while SEN69C adds carbon dioxide measurement.