Renesas will license EPC’s eGaN for low-voltage power devices globally. The deal adds second-sourcing and aims to accelerate GaN adoption in AI power, robotics, and compact converters.
Samsung will co-develop chip processes at Applied’s new EPIC Center. The $5bn facility targets atomic-scale patterning, etch, deposition, and extreme 3D integration across logic and memory.
BorgWarner’s BMS contract expands to more EV platforms from 2029. A modular BMU–CMU architecture targets 800V packs, DC fast-charge communication, and ASIL D-oriented diagnostics.
Teledyne FLIR OEM has launched a new long-range thermal ISR camera. The Neutrino SX8 ISR 50-1000 extends detection ranges for border, perimeter, and counter-UAS applications, with a factory-integrated continuous zoom lens and AI-ready architecture.
Infineon is shipping isolated gate drivers aimed at SiC inverters. The 1ED301xMC12I family uses an opto-emulator input to replace optocouplers without a PCB redesign, while tightening timing, noise immunity, and switching behaviour.
ZOLL’s Zenix monitor-defibrillator has cleared the EU MDR process now. The approval supports European rollout of a touchscreen-based professional monitor/defibrillator for EMS and hospital teams, with real-time CPR and ventilation feedback features.
Richardson Electronics has added Nxbeam MMICs to its RF portfolio. A global agreement broadens access to GaN and GaAs devices up to 76 GHz for radar, satcom, and test equipment designs.
Renesas has pushed Wi-Fi 6 into its RA6 combo MCUs. The RA6W1 and RA6W2 integrate Ceva wireless IP to reduce external radios, simplify PCB layouts, and cut BOM cost for IoT designs.
Teledyne starts production of infrared modules for SDA Tracking Layer. The company says its radiation-hardened Focal Plane Modules will support Tranche 3 satellites designed to expand missile warning and tracking from Low Earth Orbit.