Category: News
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Samsung has begun shipping HBM4 memory for AI accelerators commercially. The company says production uses a 10 nm-class DRAM process with a 4 nm logic base die, delivering 11.7 Gbps per pin, up to 3.3 TB/s per stack, and 24–36 GB capacities.
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ROHM has added HPLF5060 packages to automotive MOSFETs for 40V/60V. The new footprint targets tighter ECU layouts while improving solder-joint robustness with gull-wing leads and copper clip junctions, aiming at applications such as inverter control, electric pumps, and LED headlamps.
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Vertiv has launched Avocent MergePoint Unity 2 for secure access. The new KVM-over-IP platform targets enterprise and edge estates with FIPS 140-3 cryptography, smart-card authentication, remote BIOS/UEFI access, and virtual media, alongside configurations scaling from 8 to 32 ports.
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Northwestern has built a 3D electrode mesh for mini-brain organoids. The soft, shape-conformal framework wraps around organoids, enabling high-density recording and stimulation across most of the tissue surface.
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ByteSnap and Digi bundle embedded Linux security service. The managed offering targets long-life connected devices, combining vulnerability intelligence, targeted patching, and deployment validation for heterogeneous hardware estates.
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CEA has demonstrated dynamic electro-optical routing for photonic interposers today. The 28 nm CMOS router sets up optical paths in 18 ns, targeting package-scale networking for chiplet systems.
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Astute will showcase Mobile Mark antennas at Enforce Tac 2026. The Hall 9 presence positions UK-built RF hardware for European defence integrators seeking rugged, high-performance communications across specialist and conventional bands.
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Samsung and Getmobil are launching a Turkish refurbished electronics programme. The partnership introduces doorstep buyback and trade-in, backed by a single digital infrastructure covering valuation, pickup, refurbishment, and resale.
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A recycled-titanium helicopter bracket has completed its first flight successfully. Laser powder bed fusion produced the part from aircraft scrap powder, demonstrating a route to qualified AM titanium feedstock inside the UK defence supply chain.
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ST’s Stellar P3E MCU integrates dedicated neural acceleration on-chip hardware. The automotive controller uses a Neural-ART Accelerator to run edge inference and virtual sensing alongside safety-focused real-time cores for software-defined vehicle platforms.