Thailand approves its first national strategy for semiconductor industry development. The 2050 roadmap targets photonics, power semiconductors, sensors, advanced packaging, wafer production, and a substantially larger skilled workforce.
Tacta expands tactile sensor manufacturing with new Singapore production facility. The site will initially build Skill Capture gloves while work with A*STAR scales the underlying sensor technology.
Renesas adds multi-time programmability to its smallest GreenPAK device yet. The SLG46801 combines mixed-signal logic, analogue comparators, counters, and I²C configuration in WLCSP and STQFN packages.
M31 and Ambiq combine memory and cell IP on N12e. The Foundation IP package targets always-on edge systems with a dual-rail SPSRAM compiler and a standard-cell library designed to reduce leakage.
Microchip adds accumulated-energy monitoring across 65V digital power monitor families. The PAC1761 and PAC1861 combine 48V-system headroom, 75V transient protection, programmable alerts, and longer-term energy data.
Synopsys and TSMC extend A14 and multi-die design enablement workflows. New milestones cover agentic AI, CoWoS power delivery, co-packaged optics, and N2P interface IP including PCIe 7.0 and HBM4.
Farnell is widening access to NI Nigel AI test automation. New LabVIEW and TestStand functions move the software from engineering advice towards generated measurement code and automated test sequences.