VSMC has opened its first 300mm semiconductor fab in Singapore. Risk production is under way ahead of volume manufacturing scheduled for the first quarter of 2027.
Wolfspeed has launched premium 200mm silicon carbide substrates for customers. The n-type material targets lower defect density, improved wafer stability, and higher downstream device yield.
POLYN has begun shipping VibroSense engineering silicon for automotive evaluation. The neuromorphic analogue chip processes tyre vibration locally to estimate available road grip.
EPFL researchers have demonstrated robust self-injection locking across drive currents. The silicon nitride architecture maintains sub-10Hz intrinsic linewidths without active feedback-phase control and supports mode-hop-free 1.5GHz chirps.
FSWX gains dedicated software for phase coherent radar pulse analysis. Rohde & Schwarz is targeting DRFM jammer verification across timing, modulation, and channel-to-channel behaviour.
Ziggo is deploying unified DOCSIS 4.0 nodes across the Netherlands. Aurora Networks is combining distributed access hardware, virtualised core functions, and management software for the large-scale live rollout.
Pakal and Prohubs will commercialise silicon power semiconductor technology together. The agreement adds design-in, customer engagement, distribution, and market support for IGTO devices as Pakal expands its power conversion programme.
PicoJool has secured new funding to scale optical interconnect production. The $27.5 million Series A will expand US and Taiwan capacity as 200G VCSELs and microVCSEL products move towards qualification.