Infineon supplies silicon carbide devices for Eaton’s 800VDC transformer platform. The MVSST 2.0 targets high density AI infrastructure while the companies examine higher voltage SiC modules for later systems.
Innodisk launches DDR5 8000 RDIMM for demanding edge AI systems. Registered ECC, capacities to 64GB and additional electrical protection target data-intensive industrial and enterprise computing deployments.
Hamamatsu launches iPHEMOS-DDX microscope for advanced semiconductor package failure analysis. Three-direction tester docking and seven analytical techniques target chiplets, HBM and complex 2.5D or 3D assemblies.
Synopsys launches AgentEngineer platform for long horizon autonomous engineering workflows. Autopilot combines orchestration, persistent memory, reusable skills, security controls and governance across silicon and systems development.
SEMIFIVE secures $52 million AI accelerator contract in North America. The programme covers specification through production, with LPDDR6, PCIe Gen5 and first tape-out targeted for 2027.
Wolfspeed launches premium 200mm silicon carbide substrate for higher yields. Tighter defect and wafer shape specifications target manufacturers developing larger die and higher voltage power devices.
VSMC opens Singapore 300mm fab ahead of 2027 volume production. Risk production is underway after the facility achieved above 99% yield on its first sample lot.