Category: News
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Aurora Boardworks adds dual 3D inspection systems for PCB assembly. PARMI SPI and AOI equipment will move defect detection earlier through surface-mount production.
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Airship AI has secured $29 million in Homeland Security awards. The six-month contracts span edge processing, server-side AI, software development, and integrated sensor hardware.
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Mendaera now offers Focalist using Butterfly semiconductor ultrasound imaging technology. The commercial system combines handheld robotics, live imaging, and software guidance for needle procedures.
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Keysight has launched a dual-channel 20GHz PSG signal generator platform. The 2U instrument combines independent sources, low noise, and calibrated output to +22dBm.
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Synopsys and Amazon have signed a billion-dollar-plus custom silicon agreement. The partnership expands semiconductor IP, EDA, simulation, AI engineering, and AWS infrastructure collaboration.
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OpenAI and Synopsys will develop a specialist semiconductor design model. GPT-Synopsys will operate EDA tools directly across chip design, optimisation, and verification workflows.
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Advantech has launched a compact AI computer for autonomous drones. The ASR-D501 combines 12 TOPS edge AI, five camera interfaces, and flight controller connectivity below 10W.
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Toshiba expands its industrial digital isolator portfolio with four devices. The DCL32xx00 family combines 25Mbps links, 0.2mA typical channel current, and industrial isolation.
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SEMIFIVE and Mobilint will develop a robotics AI ASIC together. The chip will combine LPDDR6, PCIe Gen6, and UCIe-S for on-device robotics processing.
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Infineon has opened a scalable semiconductor backend facility in Thailand. The Bangkok site combines assembly, test, wafer test, and phased expansion capacity.