Blueshift is presenting PhaseBlue circuit material for RF PCB designs.
QPT has launched qDesign for AI-optimised power module packaging workflows.
Cambridge GaN Devices is sampling automotive ICeGaN for inverter designs.
ODU has supplied mass interconnects for automated DEIF converter testing.
Cyntec is showing battery junction box components for EV architectures.
Fraunhofer IAF is demonstrating GaN power modules for bidirectional charging.
Infineon will supply SiC modules for Siemens semiconductor circuit breakers.
ROHM is bringing GaN epitaxy in-house with AIXTRON production equipment.