Category: News
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Pfannenberg is reshaping its global operating model for faster execution. One Pfannenberg pulls engineering, manufacturing, digital systems, and commercial leadership into a single worldwide structure.
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Synaptics is shrinking edge AI and wireless into one chip. The SYN765x integrates Wi‑Fi 7, Bluetooth LE 6.0, Thread/Zigbee, sensing, and local processing for low-power smart devices.
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TI is compressing AI rack power delivery into two stages. The architecture tracks NVIDIA’s 800 VDC roadmap and pushes higher density, fewer conversions, and lower copper overhead into the datacentre power chain.
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Coherent is scaling InP photonics for faster AI data links. Its OFC 2026 lineup spans lasers, modulators, photodiodes, and subsystems aimed at 1.6T and 3.2T optical architectures.
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Samsung and AMD tighten HBM4 planning around rack-scale AI systems. Their expanded agreement links next-generation high-bandwidth memory supply to future Instinct accelerators, where bandwidth, packaging, power, and platform integration are now moving together.
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UK lighting faces rising WEEE scrutiny as marketplace data deepens. Fresh reporting is sharpening the scale of non-compliance across online lighting sales, increasing pressure on registration, traceability, classification, and end-of-life obligations.
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Digi extends remote telemetry into harsher and less connected sites. Its Connect Sensor XRT-M combines LTE-M and NB-IoT connectivity, MQTT support, edge processing, and ruggedised deployment for remote industrial monitoring without fixed local infrastructure.
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Microelectronics US 2026 brings applied design constraints into sharper focus. The Austin event will gather engineers across semiconductors, photonics, and embedded systems to address packaging, thermal density, supply chains, functional safety, embedded AI, and secure deployment.
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Microchip targets harsher power stages with ruggedised silicon carbide packaging. Its new BZPACK mSiC modules combine HV-H3TRB endurance, broad topology options, and a baseplate-less assembly approach for industrial and renewable energy power-conversion designs.
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Advanced Energy raises brick power density without changing thermal geometry. The new AIF13WAC lifts output to 600 W in the same full-brick format, adding PMBus control, active current sharing, and an upgrade path for existing 500 W telecom and industrial designs.