Category: News
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Applied Materials and Kioxia are expanding next-generation memory research together. Their EPIC Center programme covers new memory structures, chip stacking, packaging, and materials engineering.
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TDK has released DC-link capacitors rated for higher operating temperatures. The 800V-to-1200V series runs continuously at case temperatures reaching 135°C.
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TDK has demonstrated a 150nm meta-optic mirror for retinal displays. The transparent nanostructure replaces curved optics and is designed for semiconductor-style manufacture.
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EPC has demonstrated GaN conversion from 800V to processor cores. Its 6kW platform steps to 6V before a 5MHz stage delivers 0.9V at 11A.
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AMD is sampling enhanced Versal AI Core devices for space. Early customers can now build engineering models while Class Y qualification continues.
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AMD has launched Ross to automate embedded engineering workflows directly. The assistant links natural-language agents with AMD tools, validated documentation, and reusable engineering methods.
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AlixLabs has entered NanoIC evaluation for atomic pitch splitting technology. The six-month programme tests APS inside an advanced semiconductor integration environment.
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Toshiba has halved threshold drift in trench-gate silicon carbide MOSFETs. Revised gate-interface processing improves long-term stability while retaining low on-resistance.
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onsemi and Synaptics have rewritten terms for their planned merger. The amended agreement replaces the original stock transaction with $123-per-share cash consideration.
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Space Forge has gained DARPA ERIS awardable status for semiconductors. The assessment opens a US government route for its microgravity materials manufacturing technology.