Category: News
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Qorvo combines BAW filtering with high power GaN amplification hardware. The C-band component set targets frequency-agile pulsed radar while reducing discrete receive circuitry and transmitter power losses.
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JEDEC has published its first silicon photonics reliability standard JESD264. The framework covers qualification, manufacturing controls and responsibility across photonic dies, integrated chipsets and their supporting supply chain.
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Ekinops will expand Bluebird Fiber’s Midwest network towards 400G services. The multi-year deployment uses coherent DWDM technology across a 36,000-route-mile fibre footprint spanning 12 US states.
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Crystal Display Systems has launched matched high brightness TFT kits. The range combines panels, interface electronics, cabling and backlight hardware for integration into OEM equipment.
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CML Micro has launched a sub-GHz ISM band power amplifier. The 3 × 3 mm CMX90A002 spans 860 to 960 MHz and operates from supply voltages between 1.9 V and 4.5 V.
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Microchip and Navitas built direct rack conversion from 800 V. The 20 kW reference platform converts the rack bus to 6 V while targeting 96% efficiency at around 1 MHz.
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Racyics has brought its 22FDX UCIe PHY onto test silicon. The UCIE_PHY_TC1 chip enables physical characterisation of an x16 die-to-die interface supporting 4 and 8 Gbit/s per pin.
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Keysight and partners demonstrated continuous on-wafer characterisation reaching 250 GHz. The approach measures InP HEMTs from near DC through sub-terahertz frequencies without changing the probe setup.
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Vishay has launched 650V SOT-227 modules for industrial power conversion. Four devices combine superjunction MOSFETs with established module mechanics and immediate production availability.
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Silicon Box has passed one billion advanced packaging shipments worldwide. The Singapore manufacturer now targets two billion units before year-end as capacity continues expanding.