Category: News
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Sensor authenticity is becoming a hardware problem, not software alone. ETH Zurich has built a chip that signs data at capture to help expose manipulated media.
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Cloud-streamed XR is moving into mainstream engineering workflows today. NVIDIA’s CloudXR 6.0 support in visionOS lets Apple Vision Pro access remote RTX compute for high-end 3D, simulation, and design-review sessions.
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Europe’s space electronics push is demanding deeper avionics capability. Aurora Avionics’ Edinburgh expansion gives the company more room to scale modular launcher and orbital electronics work.
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Programmable photonics is edging closer to practical semiconductor deployment. Lumotive’s new 2D beamforming chip points to flatter optical architectures for sensing, communications, and AI data-centre networking.
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Semiconductor education is shifting toward lab-ready workflows and measurement discipline. Keysight’s new university packages bring device test, on-wafer analysis, and photonic IC measurement into structured teaching labs.
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Camera intelligence is moving on-device as edge silicon gets leaner. Hailo is using ISC West 2026 to push low-memory, low-power AI vision deeper into mass-market security designs.
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Industrial connectivity spending is accelerating as factories push analytics outward. A new forecast puts the IIoT market near $4tn by 2034 as edge computing, AI, and smart manufacturing scale together.
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Cooling hardware is tightening efficiency as AI data-centre loads rise. Delta’s latest ErP 2026-compliant EC fans at MCE 2026 target lower-power, lower-harmonic thermal management for data-centre and HVAC deployments.
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Teradyne is pushing board test further into AI server manufacturing. Omnyx combines structural, parametric, high-speed interconnect, and operational test in one platform for complex data-centre hardware.
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Europe’s ferroelectric memory push has reached an important manufacturing test. CEA-Leti and Fraunhofer IPMS have completed the first wafer exchange inside the FAMES pilot line for HZO-based memory stacks.