Category: News
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ROHM has introduced TSC3PAK for top-side-cooled SiC MOSFET power packages. The package combines surface-mount assembly with insulation and thermal performance for high-voltage power conversion.
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Thales will supply 60 GO12 radar systems to Germany’s Bundeswehr. The order adds mobile 360-degree ground surveillance for drone and vehicle detection in adverse weather.
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Our latest issue examines resilient electronics supply chains under pressure. It spans medical technology, AI-ready networks, component availability, data integrity, and connected-device compliance.
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Imec has advanced its 300mm RF silicon interposer platform further. The work adds embedded capacitors, passive modelling, and laser-assisted bonding for III-V chiplets on Si-CMOS.
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GF and Qualinx have completed a European semiconductor manufacturing flow. The Dresden-based process keeps security-critical GNSS chip production inside Europe.
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ESCATEC has secured ISO 13485 certification at its UK facility. The Lutterworth site will support regulated medical electronics manufacturing and transfer.
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Qorvo has introduced its compact X-band radar front-end module package. The QPF5012 combines power, efficiency, and receive sensitivity for arrays.
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Altera is now sampling Agilex 9 Direct RF-Series SoC FPGAs. The devices integrate converters, programmable logic, processing, memory, and RF capability.
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MAHLE and Rohde & Schwarz have combined calibration with radar. The system verifies ADAS sensor alignment and function after vehicle repairs.
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Siemens and Samsung Foundry are extending advanced-node EDA collaboration flows. The work covers verification, test, packaging, analogue, RF, and implementation.