Category: News
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CEA-Leti has demonstrated denser 22nm FeRAM using vertical HZO capacitors. The work targets embedded non-volatile memory for edge AI.
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Fraunhofer has urged Germany to accelerate applied research-to-industry technology transfer. The call reflects growing pressure on industrial innovation.
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Nexperia has reported resilient first-quarter results despite supply disruption pressures. Back-end expansion is advancing in Malaysia and the Philippines.
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Toshiba has developed a higher-voltage press-pack IEGT chip for converters. The 6500V device targets HVDC, STATCOM, and industrial motor drives.
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Imec, ASML, and TSMC have demonstrated industry-scale 2D transistor integration. The 300mm work points beyond silicon logic scaling.
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TDK has introduced B25696H DC-link capacitors for SiC converter designs. The MKP film series targets high-frequency power stages across storage, traction, renewables, and drives.
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Lantronix has partnered with Cherry and White on rapid connectivity. The platform combines rugged industrial gateways with field-deployable Wi-Fi for critical sites.
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MIKROE has introduced Spatial Anchor R1 and S1 tracking modules. They add 6-DoF accessory tracking for visionOS industrial, simulation, and prototyping workflows.
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Anritsu has introduced Tensor, an AI-assisted vector network analyser platform. The source-per-port architecture supports RF, microwave, millimetre-wave, and sub-THz characterisation.
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NeoCortec is bringing NeoMesh into Endrich’s e-IoT platform for sensors. The wireless mesh layer supports low-power industrial nodes, gateways, and monitoring systems without new cabling.