Category: News
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Renesas rad-hard ICs are flying on NASA’s Artemis II mission. The devices are being used across Orion and the Space Launch System in avionics, launch safety, power distribution, signal integrity, and onboard computing.
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ByteSnap’s new guide tracks how PCB priorities change by sector. The report moves from cost-led consumer layouts to industrial and aerospace boards shaped by harsher environments, tighter compliance, and longer validation cycles.
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Alexander Battery is expanding engineering around testing, design, and AI. The appointments deepen testing, mechanical design, and programme capacity as the UK manufacturer pushes more custom battery systems from development into production for OEMs.
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CEA and PSMC are combining photonics, RISC-V, and 3D packaging. The tie-up brings silicon photonics, microLED links, and open compute IP into interposer-based AI architectures aimed at easing bandwidth and power constraints.
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STMicroelectronics has started shipping China-made STM32 microcontrollers to customers now. Production begins with the STM32H7 family and is set to expand to STM32H5 and STM32C5 devices.
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Inelco Hunter has added sealed coolant temperature sensors to distribution. The Amphenol devices target compact thermal loops across electrified systems and cooling architectures.
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Renesas has extended its GaN charging platform to 500W today. The new HWLLC architecture targets denser, cooler AC/DC designs across industrial, infrastructure, and connected systems.
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Power Integrations has pushed flyback conversion into higher output ranges. The new TOPSwitchGaN family targets applications that previously moved to more complex resonant architectures.
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OMRON has launched a clean-suit detection module for automation systems. The B5T HVC-P2 is designed to detect human presence reliably in controlled cleanroom production environments.
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SmartRay has brought reflective-surface inspection into its ECCO X family.