Category: News
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GlobalFoundries will produce silicon interposers for TSMC’s advanced packaging programme. The $2 billion agreement adds manufacturing capacity in New York, with volume production expected to ramp during the first half of 2028.
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RaiderChip reports support for over fifty generative models across architectures. The Spanish semiconductor developer has added dense and mixture-of-experts Qwen models using firmware scheduling and dedicated transformer acceleration hardware without redesigning its NPU.
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Cirrus Logic has acquired Italian chip designer INVENTVM in Pavia. The transaction expands its engineering resources and intellectual property in audio integrated circuits and power management, following several years of collaboration between the companies.
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Infineon has introduced a 27 kW server power reference design. The three-phase architecture combines SiC and silicon switches, digital control and an integrated energy buffer, achieving more than 98% peak efficiency under specified test conditions.
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Palladyne, Federal and Mossberg are developing autonomous airborne counter-UAS interceptors. SwarmShot combines avionics, collaborative autonomy, fire control and an airborne weapon module.
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Saelig has introduced MegiQ RMS for complete 3D antenna characterisation. A motorised turntable and reflection processing allow spherical measurements in conventional laboratory spaces.
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Overview AI has launched Spark cameras for automated inline inspection. Local processing combines ten vision tools, model training, PLC communication, image storage and operator controls.
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Solace has moved Nova into volume production for 5G equipment. The module is FCC certified and transfers up to 30W through glass for outdoor customer premises equipment.
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AVerMedia and Stereolabs aligned production vision software across Jetson platforms. JetPack 7.2 support covers ZED X cameras, carrier boards, drivers and reproducible software packages.
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Aehr has secured additional Sonoma orders for AI processor burn-in. The $6 million package supports a second processor programme ahead of a planned 2027 production ramp.