Category: News
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TDK-Lambda has launched a 1500W AC-DC module series aimed at industrial, lighting, and building automation equipment, combining a wide 85-305 Vac input range with PMBus control, sealed-enclosure suitability, and support for parallel operation in higher-power designs.
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GE Aerospace is making a stronger case for time-sensitive networking as the data backbone for future vertical-lift platforms, tying open standards and upgradeability into one avionics architecture.
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NVIDIA has launched its Ising model family for quantum calibration and error-correction decoding, signalling a deeper push into the classical computing layer around quantum systems.
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AliveCor has received CE mark for its Kardia 12L system, bringing a single-cable, AI-powered handheld 12-lead ECG platform to the European market.
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ASML posted €8.8 billion in first-quarter net sales and lifted its full-year outlook, reinforcing how AI-driven fab investment is continuing to shape lithography demand.
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A UK-built life-science payload on the ISS combines fluorescence imaging, environmental sensing, and remote operation to study how biology responds to microgravity and radiation.
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Microelectronics US 2026 opens in Austin next week with more than 100 speakers across semiconductor, photonics, and embedded tracks, focusing on engineering execution rather than grandstanding around future technologies.
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AMD’s Ryzen Embedded V3000 is powering control-plane functions in Cisco’s latest N9300 switches and 8000 Series routers, linking embedded x86 compute to the scale, telemetry, and automation demands of AI infrastructure.
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EPC has introduced 5kW three-phase GaN inverter boards for BLDC motor control, targeting robotics, industrial automation, forklifts, light EVs, and other motion systems that benefit from faster switching and higher power density.
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Raytheon has demonstrated an event-based mid-wave infrared camera that tracks motion at pixel level rather than by processing full frames, cutting data load and power demand in high-speed sensing applications.