Category: News
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CAST has added bridge interfaces and software for Ethernet security. The development allows hardware MACsec engines to be inserted between existing Ethernet MACs and physical interfaces, with key agreement software supporting embedded operating systems and bare-metal applications.
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Microchip has launched two capacitive-touch controllers using parallel sensor acquisition. The MTCH3380P and MTCH3240P employ 12 ADCs to support responsive buttons, sliders and wheels in display-free interfaces, including industrial equipment and appliances operating in electrically noisy environments.
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Silicon Labs has expanded software tools for embedded AI development. Its Simplicity AI SDK is in public beta, with Databricks integration available and Hardware Intent verification planned for 2027.
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Toray has tested heat-resistant film capacitors in a prototype inverter. Joint research with Nagoya University demonstrated operation at 150°C, while thermal modelling indicates that the technology could reduce the size of an inverter’s heat dissipation structure by approximately half.
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Chips&Media has developed lossless compression technology for neural activation data. The semiconductor IP developer reports memory traffic reductions of between 35.2% and 53.5% across tested numerical formats, with hardware implementation targeted for the first quarter of 2027.
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Tenstorrent and Vayavya have expanded virtual models for chip development. Their SystemC platforms reproduce security, boot and system management functions, allowing software and validation teams to test hardware interactions before physical silicon becomes available.
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Emerson has expanded NI testing capabilities for multiport wireless systems. A four-port vector network analyser and synchronisation improvements for the PXIe-5860 transceiver extend the measurement options available within automated PXI RF test environments.
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Applied Materials and Intel are expanding joint semiconductor process research. Their collaboration spans transistor structures, interconnect scaling and three-dimensional chip packaging, with development work taking place at facilities in California and Oregon.
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Xanadu and GlobalFoundries will industrialise photonic quantum computing components together. Their agreement covers superconducting photon detectors and low-loss silicon nitride circuits, with process development and manufacturing planned on a 300 mm semiconductor production line in New York.
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Keysight has introduced switches that automate physical network test connections. The Velocity 4900 series allows laboratories to configure and reproduce test topologies remotely, with two models supporting Ethernet connections up to 100 Gbps and initial deliveries planned for January 2027.