Category: News
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Aehr has secured another major AI processor burn-in production order. The $22m deal covers automated FOX-XP systems configured to process nine 300mm wafers simultaneously before advanced packaging.
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Sony and TSMC formalise their Kumamoto image-sensor manufacturing joint venture. The binding agreement commits about ¥747 billion between the companies, with volume production of next-generation sensors targeted for 2029.
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Movellus is bringing on-die power optimisation to Samsung advanced nodes. The Aeonic platform adds telemetry and nanosecond-scale control loops for AI and HPC SoCs through Samsung Foundry’s SAFE ecosystem.
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Koh Young will double inspection equipment capacity at Yeoju complex. A second 12,800-square-metre production centre is due in August 2027 as AI-server and advanced-semiconductor demand increases.
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Comcores is adding scalable security IP to Europe’s RIGOLETTO platform. MACsec and a RISC-V hardware root of trust will support a European automotive computing programme spanning 64 project participants.
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Mycronic has secured another SLX order from a new customer. The $4m–$6m Asian order broadens the platform’s installed base, with delivery of the semiconductor photomask writer planned for Q1 2027.
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Sivers and SemiNex target InP light sources for data centres. The $3.4 million programme covers co-packaged optics, DFB laser arrays, and optical amplifiers, with sampling targeted for the second half of 2027.
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NVIDIA is building financing platforms for large AI infrastructure projects. Six financial groups have signed memorandums intended to mobilise more than $500 billion of third-party capital over time.
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NetSense uses existing 5G networks to detect and track drones. The Lockheed Martin-led system combines RF sensing, AI processing, and commercial cellular infrastructure, with pilots planned from late 2026.
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Navitas has sued Renesas over four US gallium nitride patents. The Texas action adds a patent dispute to the companies’ separate trade-secret litigation over GaN technology.