Category: News
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SEMI is using its June policy forum in Brussels to push for a more comprehensive Chips Act 2.0, with the agenda moving beyond fab announcements toward resilience, competitiveness, skills, security, and the harder work of building a durable European semiconductor ecosystem.
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IDC has sharply lowered its 2026 smartphone forecast as memory constraints worsen. The market is now expected to fall to 1.12 billion units, with higher DRAM and NAND pricing pushing vendors toward reduced configurations, higher ASPs, and tougher product decisions.
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Farnell has added Lovato Electric’s automation and protection hardware to its industrial portfolio, bringing contactors, switch disconnectors, motor-protection relays, safety devices, signalling products, and circuit-protection components into a broader stocked channel for control and power applications.
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DigiKey is now stocking MIKROE’s full Click board portfolio worldwide, bringing more than 1,950 add-on boards, plus the surrounding mikroBUS, ClickID, and mikroSDK ecosystem, into a mainstream global channel for faster embedded prototyping and evaluation.
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Rochester Electronics is extending authorised availability of Infineon’s Neuron processors beyond end of life, keeping long-lived LonWorks control designs in production at a point where redesign is costly and, in many cases, there is no direct alternative for LON network communication.
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Molex has agreed to acquire Teramount, adding detachable passive-alignment fiber-to-chip technology to its co-packaged optics stack as AI-driven data-centre optics moves closer to scale.
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Synopsys has rolled out a complete UFS 5.0, UniPro 3.0, and M-PHY v6.0 IP solution for next-generation storage, combining protocol, link, and physical layers in a single stack as edge-AI and automotive SoCs push storage bandwidth into a system-level constraint.
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AMD has signed a new letter of intent with the French government to expand AI infrastructure, training, and ecosystem support, while reinforcing its role in Alice Recoque, France’s planned first exascale supercomputer and a central platform in the country’s wider AI strategy.
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Infineon’s radiation-hardened semiconductors have completed NASA’s ten-day Artemis II mission aboard Orion, providing validated performance in deep-space power, control, and communications functions at a time when spacecraft electronics are facing rising pressure on size, weight, and efficiency.
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ADIOS has secured its first £1 million order while widening its stocked semiconductor offer across analogue and embedded parts, signalling stronger demand for alternative sourcing channels as price pressure, franchise consolidation, and lead-time concerns continue to unsettle the market.