Category: News
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PCB Technologies agrees to acquire US manufacturer Gorilla Circuits outright. The proposed $120 million transaction would add California-based PCB fabrication and assembly capabilities, subject to completion.
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Xsight introduces programmable data processor designs for lower-power network infrastructure. The E1L family includes an eight-core 100 Gbps configuration with a 25 W thermal design power.
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pSemi introduces integrated radio front ends for compact wireless devices. The PE566212 and PE566213 combine transmit amplification, low-noise reception and switching for 2.4 GHz applications.
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Elephantech plans Tokyo advanced packaging centre for AI server substrates. The Toyosu facility is scheduled to open in March 2027, supporting materials development, prototyping and evaluation.
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GlobalFoundries unveils FDX Fusion for future European semiconductor process manufacturing. The FD-SOI roadmap targets advanced digital performance alongside analogue, RF and embedded memory integration.
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Applied Materials adds UCLA researchers to its semiconductor innovation centre. The collaboration will examine semiconductor materials and process integration using industrial research facilities in Sunnyvale.
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Microchip acquires VORAGO Technologies to expand radiation-hardened semiconductor computing capabilities. The acquisition adds processors and HARDSIL process technology for demanding aerospace and industrial applications.
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ZEISS acquires Scottish holographics developer Ceres to expand optical manufacturing. The deal adds thin-film holographic optical element expertise to ZEISS Microoptics, with automotive windscreen displays an initial focus.
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BOS Semiconductors joins Japanese research into automotive chiplet interconnect technologies. The South Korean semiconductor developer will contribute SoC and chiplet design expertise to MIRISE Technologies’ research and prototyping programme for future vehicle computing architectures.
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Arteris secured additional funding for third-party semiconductor security assurance research. The $3.3 million award expands its work with BAE Systems and SiFive on repeatable methods for evaluating security weaknesses in commercially sourced IP blocks and their integration into complex chips.