Power Integrations and Ideal Power are developing semiconductor circuit breakers. Their working 800V DC prototype combines a 1700V InnoMux-2 power conversion device with B-TRAN switching, while a reference design remains in development.
Cisco has introduced new switching silicon for dense AI networks. The G302 provides 51.2T aggregate switching capacity and 200G SerDes interfaces, with 1.6T optical connectivity in associated systems and customer shipments planned before the end of 2026.
Teradyne has introduced a compact semiconductor tester for edge applications. The new UltraFLEXplus S24 shares software and instruments with the Q series, with a 24-slot configuration intended for mixed-volume device manufacturing and tri-temperature testing.
Tessolve has secured fresh investment to extend semiconductor engineering operations. Vector Line Capital is providing $75m as the Hero Electronix company pursues acquisitions in chip design, validation and testing.
Microsoft has detailed chiplet architecture for its Maia 300 accelerator. The forthcoming inference system combines HBM4, locality-aware memory control and a 96-accelerator rack, with production deployment planned for 2027.
TTM is expanding advanced PCB manufacturing capacity across five sites. Its proposed $400m programme targets asymmetrical interconnect production in China and Malaysia, adding to an existing investment commitment.
Texas Instruments has introduced three chips for AI infrastructure electronics. They cover fast power-rail event capture, 800V DC insertion protection and low-jitter timing for high-speed links.
HARTING has joined NVIDIA’s MGX ecosystem with new power assemblies. The 480V AC connection targets Vera Rubin equipment, while an 800V DC design addresses a later power architecture.
Astute signs distribution agreement covering Samwha passive and magnetic components. The authorised franchise adds capacitors, energy storage products, ferrites, inductors and transformers to its portfolio.