Micron and Anthropic are linking AI infrastructure to memory architecture. Their agreement covers HBM, DRAM, SSDs, supply, and workload-level optimisation.
IBM has demonstrated sub-one-nanometre chip technology using a nanostack architecture. The research targets future gains in logic density, SRAM scaling, and energy efficiency.
Acbel is bringing integrated EV power conversion systems to Munich. The showcase includes 400V and 800V onboard charger and DC/DC converter architectures.
EU regulators are pushing energy labels deeper into digital data. The proposed changes would expand QR-linked product information and reduce paper-based documentation across energy-related products.
Infineon has started production of its RASIC CTRX8188F radar transceiver. The 8Tx8Rx MMIC supports centralised ADAS architectures, 4D imaging radar, and scalable vehicle sensing platforms.
UK engineering companies are lagging on industrial productivity technology adoption. RAEng data shows 57% are not adopting assessed Industry 4.0 tools.
Thales Netherlands is expanding radar production and testing in Hengelo. The programme adds test infrastructure, PCB capacity, and training facilities.
Europe is keeping advanced chip manufacturing in its policy frame. Chips Act 2.0 links logic, memory, packaging, design, and industrial demand.
AlixLabs has launched Sax Forma for advanced semiconductor patterning workflows. The platform brings atomic pitch splitting into customer evaluation and process validation.