Category: News
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TASKING has demonstrated an AI-assisted workflow for safety-critical automotive development. The prototype connects semiconductor data, coding, testing, and compliance while keeping deterministic verification and human approval in the loop.
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Researchers propose a CMOS pixel architecture improving simulated near-infrared sensitivity. FDTD modelling reaches 0.94 optical efficiency at 1000nm without increasing silicon thickness.
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Zhen Ding and NTHU advance smart PCB manufacturing research together. Five projects address process optimisation, logistics, supply resilience, materials risk, and AI-enabled production management.
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Molex has invested in CAEPlus to advance active liquid cooling. BoundaryCool targets increasing processor heat loads in AI and high-performance computing infrastructure.
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TTM Technologies has agreed a $1.1 billion Epiq Solutions acquisition. The transaction extends its manufacturing portfolio into software-defined radios, embedded computing, and space electronics.
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India has approved 31 additional electronics manufacturing projects across states. The package expands domestic production across components, materials, sub-assemblies, and manufacturing equipment.
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Space Forge has selected Texas A&M for US semiconductor manufacturing. Initial work will combine material growth, processing, and characterisation before the collaboration expands into further joint research.
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Avnet Silica says semiconductor growth is tightening component availability again. Its Q3 Trendliner identifies allocation, rising lead times, and greater planning risk across several component classes.
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SBF has commercialised two automation systems developed inside electronics production. ALF automates industrial labelling, while INSPECT handles optical quality checks after SMD assembly.
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STRATUM 9 has launched a deterministic DECT NR+ industrial gateway. It carries established automation protocols over private wireless links using Nordic’s nRF9151.