Category: News
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TNO and ASML are scaling Europe’s photonic chip manufacturing base. The Eindhoven collaboration connects InP production, lithography, metrology, and process control.
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Infineon is virtualising automotive microcontroller evaluation through AWS infrastructure services. The platform supports early RISC-V assessment before physical hardware arrives.
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Integrals Power has validated UK-produced LFP material in cell testing. University of St Andrews work shows performance parity with Chinese equivalents.
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Atom Computing and Nu Quantum are linking quantum processor modules. The collaboration will combine neutral-atom systems with photonic quantum networking.
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Phlux has opened beta sampling for its infrared receiver module. The Sheffield device targets LiDAR, defence, security, and analytical instrumentation.
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Imagination Technologies is contributing GPU IP to automotive chiplet development. The European CHASSIS project is building a 5nm base die.
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STMicroelectronics has introduced a compact 3D LiDAR sensing module platform. It targets embedded depth sensing in robotics, automation, healthcare, and smart buildings.
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Nearfield Instruments has raised €330m for semiconductor metrology expansion plans. The Dutch company is scaling inspection systems for advanced chip manufacturing.
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Mouser has expanded LoRa design resources for industrial IoT deployments. The hub covers LoRaWAN architecture, low-power wireless products, gateways, modules, sensors, eBooks, and technical content for distributed sensing systems.
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Quell is targeting MIL-STD-461G failures with connector-level EMI filtering inserts. EESeal devices address emissions and susceptibility issues without PCB redesign, connector replacement, soldering, or mechanical modification.