Category: News
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FLIR introduces compact high-definition infrared camera for scientific thermal measurement. The A8481 combines a 1280 × 1024 MWIR detector with filtering and high-speed acquisition interfaces.
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Minew selects Nordic semiconductor platform for two industrial safety wearables. The MWB02 and MWC05 use the nRF54L15 for embedded processing, Bluetooth alerts and positioning support.
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China Automotive Systems gains functional safety certification for steering electronics. Its redundant AP04 electric power steering platform has received product-level ISO 26262 ASIL-D certification.
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Astera Labs unveils PCIe seven interconnect portfolio spanning optical links. Aries 7 combines retimers, redrivers and optical components, with initial customer sampling planned for late 2026.
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Morse Micro adds Indian engineering partner for Wi-Fi HaLow integration. Zilogic Systems will provide embedded software, board bring-up and validation support for connected-device developers.
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XMax agrees to acquire developer of vertical gallium nitride technology. The proposed Hexa Creation transaction centres on 1,200 V power semiconductor development rather than currently qualified commercial devices.
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Galaxia develops autonomous flight safety electronics for Canadian launch operations. The planned onboard system will assess vehicle measurements against defined flight termination criteria.
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Fibocom integrates cellular modules into Indian connected payment and tracking. Grid-OS has developed a payment soundbox and two vehicle trackers using the LE270 and LE250 module families.
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Frore introduces diamond-enhanced liquid coldplate technology for AI processor cooling. LiquidJet Diamond combines a heat-spreading material with the company’s liquid cooling architecture for concentrated thermal loads.
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DigiKey begins distributing TDK SensEI equipment for industrial condition monitoring. The edgeRX Starter integrates vibration and temperature sensing with analytical software to identify changes in machinery behaviour.