Faraday has released silicon-proven dual-protocol MIPI IP for advanced sensors. Its 14nm design supports C-PHY and D-PHY interfaces while sharing circuits to reduce area.
Nikon has confirmed its DSP-110 digital lithography system specifications today. The advanced packaging tool is due for release in April 2027, offering 72 panels an hour under defined test conditions.
ams OSRAM has joined a new optical interconnect standards effort. The Credo-led Open Compute Project workstream will address parallel micro-emitter links, building on existing VCSEL demonstrations and targeting a common specification in 2027.
Polar will manufacture enhancement-mode GaN devices using technology from imec. The US foundry has agreed a process transfer covering initial 40V-to-650V devices, while IC-Link will provide a path from design work towards commercial manufacturing.
AVL has integrated VisIC gallium nitride modules into a vehicle. The demonstrator extends earlier dynamometer work into a complete electric drivetrain, although published peak efficiency results still come from bench tests.
Credo has outlined a parallel optical cable for AI infrastructure. Its proposed 1.6T ZeroFlap design divides high-speed electrical lanes among lower-rate optical channels, with a target reach of 50 metres and shipments planned for 2027.
Marvell has introduced two six-channel CXL memory expansion controller designs. Structera X 3406 and 3506 support DDR4 or DDR5 respectively, adding PCIe 6.0 host connections, multi-host sharing and compression ahead of planned sampling in 2027.
Lumentum and partners will demonstrate optical PCIe links within racks. Their proof of concept combines 1060nm VCSEL arrays, Corning multimode fibre and Astera Labs Scorpio switching, targeting parallel 32Gb/s NRZ channels and an error-free PCIe 5 link.