CTS has launched its first digital temperature sensor platform globally. The range combines precision measurement, digital output, and configurable probe assemblies for industrial, medical, transport, and electronics applications.
Knowles has launched compact attenuators spanning DC to 20GHz operation. The ATT A-Series combines thin-film construction, 0dB-to-20dB standard attenuation, and power handling up to 6.5W in a 2.03×1.65mm surface-mount package.
Murata has begun mass production of 0201 three-terminal low-ESL MLCCs. The 0.6×0.3mm LLD series cuts mounting area by around 64% while targeting high-frequency power stabilisation close to fast ICs.
Gigaphoton has developed on-site neon recycling for ArF lithography lasers. The hTGM for ArF system recovers used gas inside semiconductor fabs, reaches a 50% neon recycling rate, and can serve up to five lasers.
Renesas has launched compact 650V GaN for 800V power systems. The dual-side-cooled 8×8mm PQFN targets high-density AI data centre conversion, with 20mΩ on-resistance and a 57% smaller footprint than Renesas’ TOLT package.
Pickering expands its LXI platform with modular 2A switching hardware. The 65-217 scales from 64×8 to 384×8 while adding front access servicing, self-test, and unterminated crosstalk measurement support.
Signaloid joins CERN openlab to test distribution extended computing hardware. The project will assess Monte Carlo event generation performance, numerical accuracy, and integration effort for High-Luminosity LHC workloads.
Air Liquide will invest €170 million in Japanese semiconductor infrastructure. New ultra high purity gas units will support expansion of an existing advanced logic chip facility.