Category: News
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SEALSQ increased its EeroQ stake to back helium-qubit development further. The follow-on investment targets a US-centred quantum hardware roadmap, and a planned Geneva demonstration linking quantum processors with post-quantum secure semiconductor components.
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Rutronik is stocking ADLINK’s cExpress-R8 COM Express edge modules now. The 95 mm × 95 mm Type 6 design combines Ryzen Embedded 8000 compute and an integrated NPU, with up to 96 GB DDR5 and PCIe Gen4 expansion.
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Rice researchers patterned diamond cooling layers across 2-inch semiconductor wafers. The team reports selective-area diamond growth that cut device operating temperatures by 23°C, using process flows intended to fit heterogeneous integration and high-power electronics.
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Tower and Xanadu have tightened their silicon photonics partnership further. The companies have co-engineered a production flow for Xanadu’s custom material stack on Tower’s high-volume SiPho platform, targeting manufacturable photonic quantum hardware for fault-tolerant systems.
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MIT has demonstrated paired PUFs using standard CMOS fabrication steps. A new “twin fingerprint” method lets two chips authenticate each other directly, avoiding external storage of secret fingerprint data, and targeting power-constrained paired devices such as medical sensors.
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Ericsson is pushing AI inference deeper into 5G radio hardware. Ahead of MWC 2026, the company has launched AI-ready Massive MIMO radios with neural network accelerators, plus RAN software updates for beamforming, positioning, and coverage prediction.
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Danisense has widened its DN1000ID range with higher isolation distance. The DN1000ID-CP02 extends creepage and clearance to 38 mm and targets high-current, high-voltage power measurement, including EV chargers and energy storage hardware, with 1 ppm linearity at 1000 A continuous.
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Niobium has lined up Samsung Foundry for FHE silicon production. A partnership with SEMIFIVE covers design, packaging, and test for an 8nm 8LPU accelerator intended to run fully homomorphic encryption workloads at practical speeds in cloud and AI infrastructure.
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Nordson will showcase coating and soldering systems at APEX 2026. In Anaheim, the company plans live demonstrations focused on process control, traceability, and higher-yield PCB assembly, including updates to its ASYMTEK Select Coat platform and its SELECT Synchro selective soldering line.
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Mouser is shipping u-blox MAYA-W3 Wi-Fi 6 modules now globally. The host-based range targets healthcare and industrial systems with SISO Wi-Fi 6/6E, Bluetooth Low Energy 5.4 with LE Audio support, multiple antenna options, and evaluation kits intended to accelerate integration.