Category: News
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LITILIT is expanding femtosecond-laser production for PFAS-free surface processing applications. Micro- and nanoscale texturing can replace selected fluorinated coatings and chemical treatments.
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DigiKey and Machinechat have combined sensors, hardware, and local software. The rapid engineering kit turns environmental measurements into dashboards, storage, and alerts.
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Mouser now stocks TI’s compact UCC33420-Q1 isolated DC-DC power module. The 1.5W device integrates its planar transformer and switching stage.
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BAE Systems is funding new postgraduate UK RF engineering training. NMITE’s master’s programme combines wireless systems teaching with industrial projects and mentoring.
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Hitachi Energy will build Elmed’s two international HVDC converter stations. The €770 million contract covers valves, transformers, switchgear, digital control, and commissioning.
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Kioxia has begun sampling 332-layer tenth-generation BiCS Flash memory devices. Direct wafer bonding raises density and interface speed while reducing read and write power.
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GigaDevice has entered the industrial EEPROM market with GD24CL devices. Endurance reaches four million write cycles, with retention specified at 100 years.
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Ultralytics has optimised YOLO26 models directly for Intel edge processors. OpenVINO deployment spans CPUs, integrated GPUs, and NPUs for industrial vision.
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Portwell has expanded its SMARC platform for compact edge systems. PCOM-BC00 combines Intel Atom processing, LPDDR5, dual 2.5GbE, cameras, and industrial-temperature options.
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TU Eindhoven has expanded semiconductor research links with Arizona universities. The five-year partnership covers photonics, computing, education, and industrial placements.