Category: News
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LightSolver and HLRS have benchmarked photonic acceleration for sparse solvers. Emulator results project substantial time reductions against established GPU algorithms, although physical-hardware validation remains a separate step.
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Rohde & Schwarz has extended system amplification coverage to 53GHz. The SAM200 family targets satellite, aerospace, and telecoms test setups requiring greater drive power at millimetre-wave frequencies.
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AeroZero testing links thermal protection with wider composite system behaviour. Toray composite trials show that insulation thickness, substrate selection, retained mechanical strength, and frequency-dependent dielectric performance must be considered together after high-temperature exposure.
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Alibaba has detailed its next accelerator for large AI systems. Zhenwu V900 provides 216GB memory, 1,200GB/s inter-chip bandwidth, FP8 and FP4 support, and forms part of a wider compute, networking, and storage architecture.
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Quectel has launched a higher-performance board for industrial edge systems. QSM603FCP combines MediaTek MT8371 processing, a 10.3-TOPS NPU, LPDDR5X memory, high-resolution multimedia support, industrial interfaces, Ethernet, Wi-Fi, Bluetooth, and LTE connectivity.
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Semtech and Palo Alto Networks are linking industrial edge security. The integration combines AirLink connectivity, next-generation firewalls, encrypted links, and automated certificate management for utilities and critical infrastructure operating large fleets of distributed connected assets.
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Hygon is moving C86 processors into embedded industrial systems worldwide. The 1000 series combines four cores, eight threads, DDR4 or DDR5 support, and local graphics processing for robotics, machine vision, factory automation, and edge computing.
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GSME and Teradyne are building a semiconductor test centre together. The 42,000-square-foot Silicon Valley facility will support device evaluation, test development, pilot production, demonstrations, and training across AI, automotive, photonics, RF, and power semiconductor programmes.
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Cognex has launched AI-assisted identification for semiconductor wafers and panels. In-Sight 1750 targets degraded markings, difficult substrates, production traceability, and migration from installed 1740 systems without requiring equipment builders to replace the wider identification architecture.
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Cadence is extending ChipStack AI into automated RTL generation workflows. The new agent creates and revises RTL from higher-level requirements while using established EDA engines to assess functionality, power, performance, and area before implementation.