Category: News
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e-peas has widened photovoltaic harvesting across sharply changing light conditions. The AEM15820 combines separate low- and high-power conversion paths within one power-management IC.
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Philips has cleared a redesigned reusable pulse-oximetry sensor for America. Revised optical engineering and broader validation produced improved measurement consistency across evaluated patient groups.
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GÖPEL has automated boundary-scan programme generation within CASCON 4.11 software. The release also expands analogue measurement, netlist analysis, and processor-emulation functions.
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Europe’s processor programme has completed its second major development stage. Demonstrations covered Rhea1 silicon, RISC-V acceleration, scientific software, design tools, and memory compression.
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Infineon’s PSoC Edge kit unifies processing, sensing, and wireless connectivity. The platform supports multimodal edge-AI development across industrial, medical, wearable, and robotic systems.
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NXP’s i.MX 95 processors are now entering wider distribution channels. The platform combines heterogeneous Arm processing, neural acceleration, security, and high-speed industrial connectivity.
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Researchers have demonstrated efficient perovskite LEDs using vacuum deposition techniques. Controlled crystallisation produced 21.9% efficiency alongside narrow, high-purity light emission.
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IQE has raised revenue guidance as photonics demand accelerates sharply. Indium-phosphide wafers for AI data centres are leading the recovery.
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Microsoft will deploy AMD’s Helios rack architecture across Azure infrastructure. New processor-led virtual machines will support AI pipelines, EDA, and technical computing.
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Keysight is bringing guided structural simulation into electronics development workflows. Multiphysics begins with drop, shock, and vibration analysis before prototyping.