Category: News
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EnSilica joins the CHERI Alliance to harden custom ASICs today. The mixed-signal supplier says it will use CHERI capability-based hardware techniques to strengthen memory safety for automotive and industrial silicon.
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UK Space Agency funded three studies for orbital materials manufacturing. Space Forge and OrbiSky will examine semiconductor seed crystals and ZBLAN fibre production in Low Earth Orbit, targeting higher-performance power electronics and lower-loss optical links.
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Rohde & Schwarz has pushed mid-range spectrum analysis to 44GHz. The new FPL1044 spans 10Hz to 44GHz and adds a 40MHz real-time spectrum analysis option across the FPL family, targeting Ka-band and adjacent high-frequency test workloads.
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LG will show 11MP diagnostic displays and 3D surgical monitors. At World Health Expo 2026 in Dubai, the company is highlighting a 40-inch 5,120 × 2,160 curved ultrawide diagnostic monitor and a 32-inch 3D surgical display aimed at procedural imaging.
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STMicroelectronics has closed its deal for NXP’s MEMS sensors unit. The all-cash transaction, priced at up to $950m, expands ST’s automotive and industrial sensing portfolio and pulls in established platforms and engineering teams to feed its MEMS roadmap.
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RIR introduced 1,200V SiC MPS diodes for EV powertrains today. The TO-247-2L devices span 10A to 40A and target high-frequency power conversion in chargers, inverters, and industrial drives where switching loss and thermal headroom dominate design.
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A low-power sensor node runs machine learning without the cloud. A new modular architecture pairs heterogeneous environmental sensing with on-device inference, adaptive LoRaWAN reporting, and solar-assisted energy management to reduce traffic while keeping event detection local.
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Vertical Aerospace has chosen Evolito to power its Valo aircraft. The partnership centres on integrated electric propulsion units combining ultra-lightweight motors and DAL-A power electronics, with the two companies aiming to certify the engines with the UK CAA, alongside EASA validation.
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Edinburgh team reports a recoverable hexagonal germanium–tin semiconductor class today. The group used extreme pressure and heat to create stable GeSn alloys that could improve light–electricity conversion in optoelectronic components for processors, imaging systems, and data-centre hardware.
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TDK-Lambda has introduced a 1U 3.5kW hot-swap supply for industry. The HFE3500 series supports redundant rack configurations and parallel operation, targeting automation, ATE, and communications systems that need high-density bulk power with monitoring and control via PMBus.