Category: Electronics
-
SEMIFIVE secures $52 million AI accelerator contract in North America. The programme covers specification through production, with LPDDR6, PCIe Gen5 and first tape-out targeted for 2027.
-
Wolfspeed launches premium 200mm silicon carbide substrate for higher yields. Tighter defect and wafer shape specifications target manufacturers developing larger die and higher voltage power devices.
-
VSMC opens Singapore 300mm fab ahead of 2027 volume production. Risk production is underway after the facility achieved above 99% yield on its first sample lot.
-
Merlin Flex expands UK long flex manufacturing with lamination equipment. The new vacuum press raises standard continuous production capability to 1.8 metres for demanding electronics applications.
-
Quobly expands silicon quantum development through Europe’s FAMES pilot line. Advanced process access will support later QSOI processor generations alongside the company’s 300mm industrialisation work with STMicroelectronics.
-
IP Infusion is extending OcNOS across Broadcom Qumran3 networking platforms. Planned support spans access, aggregation, transport, and core hardware with port speeds reaching 800G.
-
Synopsys has launched autonomous engineering agents across silicon-to-systems design workflows. The Autopilot platform combines orchestration, memory, governance, and model choice ahead of general availability planned for late 2026.
-
VSMC has opened its first 300mm semiconductor fab in Singapore. Risk production is under way ahead of volume manufacturing scheduled for the first quarter of 2027.
-
Wolfspeed has launched premium 200mm silicon carbide substrates for customers. The n-type material targets lower defect density, improved wafer stability, and higher downstream device yield.
-
EPFL researchers have demonstrated robust self-injection locking across drive currents. The silicon nitride architecture maintains sub-10Hz intrinsic linewidths without active feedback-phase control and supports mode-hop-free 1.5GHz chirps.