Category: Electronics
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Ziggo is deploying unified DOCSIS 4.0 nodes across the Netherlands. Aurora Networks is combining distributed access hardware, virtualised core functions, and management software for the large-scale live rollout.
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Pakal and Prohubs will commercialise silicon power semiconductor technology together. The agreement adds design-in, customer engagement, distribution, and market support for IGTO devices as Pakal expands its power conversion programme.
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PicoJool has secured new funding to scale optical interconnect production. The $27.5 million Series A will expand US and Taiwan capacity as 200G VCSELs and microVCSEL products move towards qualification.
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Singapore has launched SG Semiconductor as its national chip identity. The initiative combines sector promotion with advanced packaging, silicon photonics, process control, and manufacturing research partnerships.
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Inission will merge its two Norwegian electronics manufacturing operations together. The Løkken and Halden factories will remain open, with the combined organisation intended to increase resource sharing and domestic dual sourcing.
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Wise Integration and Navitas are combining digital control with semiconductors. The collaboration targets AI data centre power supplies and wider grid-to-chip conversion using GaN and SiC devices.
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Trio-Tech’s semiconductor back-end revenue nearly doubled during fiscal year 2026. Reliability-testing demand, expanded Malaysian capacity, and automotive burn-in work lifted its year-end backlog to $24.2 million.
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Thailand approves its first national strategy for semiconductor industry development. The 2050 roadmap targets photonics, power semiconductors, sensors, advanced packaging, wafer production, and a substantially larger skilled workforce.
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Microchip adds accumulated-energy monitoring across 65V digital power monitor families. The PAC1761 and PAC1861 combine 48V-system headroom, 75V transient protection, programmable alerts, and longer-term energy data.
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Synopsys and TSMC extend A14 and multi-die design enablement workflows. New milestones cover agentic AI, CoWoS power delivery, co-packaged optics, and N2P interface IP including PCIe 7.0 and HBM4.