Category: Electronics
-
Teradyne has launched Iris 100 for production microLED optical testing. The system characterises individual emitters while integrating optical and electrical measurements with UltraFLEXplus.
-
Lightera will nearly triple submarine fibre manufacturing capacity by 2029. The Denmark and US investment also prepares production for emerging multicore subsea systems.
-
CUbIQ has integrated continuous-variable quantum key distribution into QSFP-28 optics. The pluggable demonstrator operates alongside 200G FR4 links on an NVIDIA-based AI system.
-
Lightera is demonstrating four-core fibre in OIF interoperability trials publicly. The 125µm design supports 500m and 50km links while reducing physical fibre requirements.
-
Coherent has launched PhotonLink for integrated AI datacentre optical connectivity. The platform combines lasers, silicon photonics, optics, fibre, detectors, assembly, and test across several packaging architectures.
-
Teledyne e2v has introduced Nexora backside illuminated global shutter sensors. The 12MP and 16MP devices combine high frame rates, compact packaging, and 3.2µm pixels for machine vision.
-
SMART Photonics and GlobalFoundries are combining InP with silicon photonics. Their open-access foundry service targets integrated optical products from the second half of 2027.
-
Imec has demonstrated a 100GHz Ge/Si avalanche photodiode receiver platform. The 5V device delivered net 400Gbps reception with improved sensitivity on a 300mm silicon photonics process.
-
Mitutoyo has opened a semiconductor metrology centre in Dresden, Germany. The Silicon Saxony facility brings nanometre-scale measurement, inspection, applications support and training closer to Europe’s expanding chip-manufacturing ecosystem.
-
EFC has broken ground on its Texas semiconductor materials plant. The $210 million McGregor project will add chemical synthesis, specialty gas handling, laboratory and logistics capacity for US chip manufacturing.