Category: Electronics
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Rohde & Schwarz combines fast capture with mixed-domain EMC debugging. The MXO 3 links waveform acquisition, spectrum analysis, and high-resolution measurements for earlier fault isolation.
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Kontron has opened German production of industrial 5G communication modules. The Düsseldorf line will serve automotive, factory, energy, medical, infrastructure, and rail applications.
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Germany will provide €659m for four new semiconductor manufacturing projects. The plants cover silicon carbide wafers, power MOSFETs, production metrology, and radiation detectors.
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Intel will invest €5bn to expand processor manufacturing at Leixlip. The programme adds Intel 3 capacity, equipment, automation, and cleanroom utilisation for Xeon 6 and later products.
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ADIOS now lists almost seven hundred thousand current components online. The UK distributor is expanding stocked inventory, supplier auditing, and component verification as purchasing teams seek alternatives to increasingly consolidated authorised channels.
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IMI has integrated compact mass-flow control for demanding OEM systems. The controllers combine sensing, valve actuation, electronics, and digital communications for semiconductor, analytical, medical, and industrial equipment.
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Silex has introduced Wi-Fi 7 for industrial embedded gateway designs. The module supports simultaneous dual-band operation, multi-link functions, Linux integration, and high client counts across automation, machine-vision, and edge-computing systems.
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Nippon Kinzoku is expanding ultra-thin electrical steel for efficient motors. Laminations below 0.1mm are intended to reduce high-frequency core losses in compact motors, transformers, reactors, compressors, and power-conversion equipment.
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TCS will rebuild ABB’s global networks around centralised AI operations. The multi-year programme covers LAN, WAN, and SD-WAN modernisation, central monitoring, cybersecurity, and service integration across a complex international industrial estate.
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Imec and Diraq have expanded silicon spin-qubit control to eight. The 300mm CMOS-compatible array combines coherent operation, shared readout, and adjacent two-qubit gates while exposing the manufacturing demands that will shape larger quantum processors.