Category: Electronics
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Kigen certifies automotive eSIMs against latest GSMA IoT security requirements. The eSA-certified platform supports SGP.32 v1.3 on Infineon TEGRION silicon and adds a test path for post-quantum cryptography ahead of October OEM sampling.
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Farnell is widening access to NI Nigel AI test automation. New LabVIEW and TestStand functions move the software from engineering advice towards generated measurement code and automated test sequences.
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LightSolver and HLRS have benchmarked photonic acceleration for sparse solvers. Emulator results project substantial time reductions against established GPU algorithms, although physical-hardware validation remains a separate step.
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Rohde & Schwarz has extended system amplification coverage to 53GHz. The SAM200 family targets satellite, aerospace, and telecoms test setups requiring greater drive power at millimetre-wave frequencies.
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AeroZero testing links thermal protection with wider composite system behaviour. Toray composite trials show that insulation thickness, substrate selection, retained mechanical strength, and frequency-dependent dielectric performance must be considered together after high-temperature exposure.
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Cadence is extending ChipStack AI into automated RTL generation workflows. The new agent creates and revises RTL from higher-level requirements while using established EDA engines to assess functionality, power, performance, and area before implementation.
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Siemens and TSMC automate DRC fixes across advanced IC workflows. The agent combines Calibre, Aprisa, and Solido software while the wider collaboration extends into advanced packaging, silicon photonics, and A14 process enablement.
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European agencies are funding AI-native methods for faster chip design. The 20-month SPRIND-NADI challenge could provide selected teams with up to €9.6 million each across architecture, RTL generation, verification, and production-ready implementation.
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Alps Alpine developed an SMD automotive encoder for automated assembly. The EC11P improves signal detection while removing manual through-hole insertion from compatible production lines.
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ITRI has unveiled a 3.2Tbps silicon photonics optical engine platform. The programme doubles its previous generation while building a commercialisation network spanning design, fabrication, packaging, and test.