Category: Electronics
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Samsung has begun shipping HBM4 memory for AI accelerators commercially. The company says production uses a 10 nm-class DRAM process with a 4 nm logic base die, delivering 11.7 Gbps per pin, up to 3.3 TB/s per stack, and 24–36 GB capacities.
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ROHM has added HPLF5060 packages to automotive MOSFETs for 40V/60V. The new footprint targets tighter ECU layouts while improving solder-joint robustness with gull-wing leads and copper clip junctions, aiming at applications such as inverter control, electric pumps, and LED headlamps.
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Vertiv has launched Avocent MergePoint Unity 2 for secure access. The new KVM-over-IP platform targets enterprise and edge estates with FIPS 140-3 cryptography, smart-card authentication, remote BIOS/UEFI access, and virtual media, alongside configurations scaling from 8 to 32 ports.
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Northwestern has built a 3D electrode mesh for mini-brain organoids. The soft, shape-conformal framework wraps around organoids, enabling high-density recording and stimulation across most of the tissue surface.
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CEA has demonstrated dynamic electro-optical routing for photonic interposers today. The 28 nm CMOS router sets up optical paths in 18 ns, targeting package-scale networking for chiplet systems.
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Astute will showcase Mobile Mark antennas at Enforce Tac 2026. The Hall 9 presence positions UK-built RF hardware for European defence integrators seeking rugged, high-performance communications across specialist and conventional bands.
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Samsung and Getmobil are launching a Turkish refurbished electronics programme. The partnership introduces doorstep buyback and trade-in, backed by a single digital infrastructure covering valuation, pickup, refurbishment, and resale.
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ST’s Stellar P3E MCU integrates dedicated neural acceleration on-chip hardware. The automotive controller uses a Neural-ART Accelerator to run edge inference and virtual sensing alongside safety-focused real-time cores for software-defined vehicle platforms.
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Ireland has launched I-C3 to accelerate custom chip design locally. The new competence centre, coordinated by Tyndall, will give startups and SMEs access to design tools, pilot lines, training, and funding routes under Europe’s Chips Act programme.
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Lenovo has earned SERI Champion status for electronics sustainability leadership. The recognition follows the company’s adoption of the R2v3 standard across multiple manufacturing centres for responsible electronics processing and reverse supply chain control.